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TITLE
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AUTHOR
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BOARD LEVEL ASSEMBLY AND RELIABILITY CONSIDERATIONS FOR QFN TYPE PACKAGES
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Ahmer Syed and WonJoon Kang
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Abstract
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CONSIDERATIONS IN THE DEVELOPMENT OF AN 0201 COMPONENT ASSEMBLY PROCESS
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Alan Rae, Joe Renda, and Joe Belmonte
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Abstract
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THE EFFECT OF NITROGEN REFLOW SOLDERING IN A LEAD-FREE PROCESS
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Anders Åström
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Abstract
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THE NEXT-GENERATION INFORMATION EXCHANGE FRAMEWORK FOR ELECTRONICS MANUFACTURING: FRAMEWORK IMPLEMENTATION PROJECT FROM THE GEORGIA INSTITUTE OF TECH
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Andrew Dugenske et al.
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Abstract
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A COMPARISON BETWEEN POWER AND THERMAL CYCLING FOR A FC PBGA
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Andrew Mawer, D. Hodges Popps, and G. Presas
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Abstract
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ODM OR CDM?
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Bill Coker
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Abstract
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JOINT GROUP ON POLLUTION PREVENTION LEAD-FREE SOLDER PROJECT
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Brian E. Greene
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Abstract
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NEMI LEAD-FREE ASSEMBLY PROJECT: COMPARISON BETWEEN PbSn AND SnAgCu RELIABILITY AND MICROSTRUCTURES
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Carol Handwerker et al.
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Abstract
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LEAD-FREE WAVE SOLDERING - TIGHTER PROCESS WINDOWS NEED TIGHTER PROCESS CONTROLS
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Chrys Shea and *Keith Howell
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Abstract
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REDUCING VARIATION IN OUTSOURCED SMT MANUFACTURING THROUGH THE USE OF INTELLIGENT STENCIL SYSTEMS
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Chrys Shea, Valentijn Van Velthoven, and Ron Tripp
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Abstract
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EVALUATION OF WIRE BONDING PERFORMANCE, PROCESS CONDITIONS, AND METALLURGICAL INTEGRITY OF CHIP ON BOARD WIRE BONDS
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Daniel T. Rooney, Ph.D. et al.
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Abstract
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MANUFACTURING AND RELIABILITY OF PB-FREE AND MIXED SYSTEM ASSEMBLIES (SNPB/PB-FREE) IN AVIONICS ENVIRONMENTS
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Dave Nelson and Hector Pallavicini et al.
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Abstract
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IMPLICATIONS OF USING LEAD-FREE SOLDERS ON X-RAY INSPECTION OF FLIP CHIPS AND BGAS
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David Bernard
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Abstract
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CONSIDERATIONS FOR MINIMIZING RADIATION DOSES TO COMPONENTS DURING X-RAY INSPECTION
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David Bernard et al.
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Abstract
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EMERGING AOI TECHNOLOGY - 2004 AND BEYOND
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David Doyle
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Abstract
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INVESTIGATION OF SOLDER/FLUX RESIDUE EFFECT ON RF SIGNAL INTEGRITY USING REAL CIRCUITS
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David Geiger and Dr. Dongkai Shangguan
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Abstract
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RELIABILITY STUDY OF SOLDER JOINTS FOR 0201 COMPONENTS
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David Geiger et al.
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Abstract
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TECHNICAL ASSESSMENTS AND COST ANALYSIS OF THE EMBEDDED PASSIVE TECHNOLOGIES IN THE MULTI-LAYER CIRCUIT BOARDS (Part I - Resistance)
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Dominique Numakura
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Abstract
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TOTAL PROCESS CONTROL AND MANAGEMENT- FROM RELIABILITY, STABILITY, TRACEABILITY TO PREDICTABILITY (RSTP)
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Dr. Paul P.E. Wang et al.
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Abstract
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EPOXY FLUX BRIDGES THE GAP TO LOW COST NO-CLEAN FLIP CHIP ASSEMBLY
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Dr. Wusheng Yin et al.
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Abstract
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FILLED NO-FLOW UNDERFILLING - PROCESS AND MATERIALS
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Dr. Wusheng Yin, Dr. H-S Hwang, and Dr. N-C Lee
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Abstract
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EVALUATING THE EFFECT OF SOLDER PASTE RESIDUES ON RF SIGNALS BETWEEN 5 AND 10 GHZ
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Dwayne R. Shirley et al.
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Abstract
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NO WINNERS HERE: COVERT MONEY LOSSES IN OUTSOURCED ELECTRONICS MANUFACTURING PROGRAMS
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Edwin B. Smith, III
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Abstract
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SOLDER JOINT RELIABILITY ASSESMENT OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER
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Fay Hua et al.
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Abstract
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IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION
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Frank Grano et al.
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Abstract
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FLIP CHIP ON STANDARD LEAD FRAME: LOWERING THE COST OF FLIP CHIP OWNERSHIP
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Frank Juskey
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Abstract
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DFN, A LEAD FRAME SIP FOR WIRELESS
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Frank Juskey
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Abstract
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DIE ATTACH REWORK - PROCESS COMPARISON
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Fulvio Fontana
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Abstract
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USING "SIGNATURE IDENTIFICATION" FOR RAPID AND EFFECTIVE X-RAY INSPECTION OF BALL GRID ARRAYS
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Gil Zweig
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Abstract
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2D OR NOT 2D, THAT IS THE QUESTION!
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Glenn Wyllie and Mark Norris
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Abstract
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ALTERNATIVE LEAD FREE BALL MATERIALS WITH IMPROVED INTERFACE PROPERTIES
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H.-J. Albrecht et al.
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Abstract
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HOW TO SOLDER NON-STANDARD CBGAs OF 1.0mm PITCH
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Haoqiang Song and Zhe Liu
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Abstract
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ASSEMBLY ISSUES WITH MICROVIA TECHNOLOGIES
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Harjinder Ladhar and Sundar Sethuraman
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Abstract
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APPLYING SIX SIGMA TECHNIQUES TO CONTROL SCRAP COSTS AND IMPROVE QUALITY IN SMT MANUFACTURING
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Hersh Kohli and *SooBeng Khoh, Ph.D.
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Abstract
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CAPITAL EQUIPMENT PRODUCTION
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Ian McEvoy
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Abstract
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LEVERAGING MAINSTREAM DESIGN & ANALYSIS TOOLS FOR MEMS
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Ilya Mirman
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Abstract
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NEMI TIN WHISKER TEST METHOD STANDARDS
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Irina Boguslavsky
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Abstract
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SOLDER PASTE STENCIL PRINTING PERFORMANCE BASED ON STENCIL AND SOLDER PASTE TECHNOLOGY
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James Adriance et al.
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Abstract
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EVALUATION OF LEAD-FREE SOLDER BONDS AND EFFECTS OF THE LEAD-FREE PROCESS ON DEVICES USING ACOUSTIC MICRO IMAGING
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Janet E. Semmens
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Abstract
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THERMALLY INDUCED OUT OF PLANE DEFORMATION ANALYSIS FOR A FLIP CHIP ON FLEX 35MM TBGA
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Jennifer Muncy et al.
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Abstract
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USE OF SUBSTRATE ETCHBACK TECHNOLOGY AND ROTATED DIE PLACEMENT TO ACHIEVE HIGH DENSITY INTERCONNECT
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Jesse Phou
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Abstract
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IN SEARCH OF THE PERFECT BOM
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Jim Arnold
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Abstract
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SOLID-METAL THERMAL COLUMNS IN CONVENTIONAL PCBs
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Jim Fraivillig
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Abstract
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BLACK PAD DEFECT: INFLUENCE OF GEOMETRY AND OTHER FACTORS
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Jodi Roepsch, Robert Champaign, and Barbara Waller
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Abstract
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IMPROVING THE ACCEPTANCE OF FLIP CHIP
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John Davis et al.
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Abstract
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TOWARDS WAFER-SCALE MEMS PACKAGING: A REVIEW OF RECENT ADVANCES
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John Heck and Steve Greathouse
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Abstract
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CLEANING NEW SOLDER PASTE FORMULATIONS WITH A UNIQUE LOW-VOC AQUEOUS CLEANING AGENT
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John R. Sanders et al.
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Abstract
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THE DEVELOPMENT OF ADVANCED X-RAY INSPECTION
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Jon C. Dupree
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Abstract
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EMERGING TRENDS IN SELECTIVE SOLDERING TECHNOLOGY
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Jonathan Wol and Adrian De’ath
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Abstract
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AN EXAMINATION OF 'DRY BOX' DESICCANT STORAGE WITHIN THE PCB MANUFACTURING ENVIRONMENT
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Kevin McCarten
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Abstract
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EFFECT OF PRINTED WIRING BOARD WARPAGE ON BALL GRID ARRAYS OVER TEMPERATURE
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Kyra Ewer and Jeffrey Seekatz
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Abstract
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ELECTROLESS WAFER-LEVEL REDISTRIBUTION - FURTHER DEVELOPMENT AND NEW APPROACHES FOR SYSTEM INTEGRATION
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L. Boettcher et al.
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Abstract
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THIN ARRAY POLYMER PACKAGING FOR RF MODULES
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Leo M. Higgins III, Ph.D
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Abstract
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INTEGRATING COMMERCIAL OFF THE SHELF PACKAGES (COTS) INTO GUIDED MISSILE SYSTEMS: THE EMMA PROGRAM
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Leopold A. Whiteman, Jr.
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Abstract
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ORGANIC FLIP CHIP PACKAGING DESIGN AND MANUFACTURING CHALLENGES
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Louis Liu et al.
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Abstract
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EVALUATION OF SEMICONDUCTOR PACKAGE RELIABILITY WITH FOUR METAL LAYER PLASTIC BALL GRID ARRAY LAMINATE SUBSTRATES
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Lucy Grace Dearce et al.
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Abstract
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SELECTIVE SOLDERING WITH LEAD-FREE ALLOYS
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Marc Dalderup et al.
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Abstract
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LEAD-FREE CARD ASSEMBLY AND REWORK FOR COLUMN GRID ARRAYS
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Marie Cole et al.
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Abstract
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FEASIBILITY ANALYSIS METHODOLOGY FOR STACKED-DIE VS. SINGLE-DIE PACKAGE CONSIDERATIONS
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Mark Gerber and Shawn O’Connor
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Abstract
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LONG TERM RELIABILITY OF 0.8MM PITCH BGA PACKAGES DOUBLE-SIDE MOUNTED ON A THIN PRINTED CIRCUIT BOARD
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Mark Logterman et al.
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Abstract
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SOLDER JOINTS FOR HIGH TEMPERATURE ELECTRONICS
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Mathias Nowottnick et al.
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Abstract
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HAND PLACING LEADLESS AND FINE PITCH LEADED COMPONENTS WITH SIPAD SOLID SOLDER DEPOSITION
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Matthew J. Kehoe
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Abstract
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INTEGRATION OF AOI IN A TOTAL QUALITY MANAGEMENT PROGRAM
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Matthew T. Holzmann
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Abstract
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EVALUATION, OPTIMIZATION, AND RELIABILITY OF NO-FLOW UNDERFILL PROCESS
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Michael Colella
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Abstract
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CAPITAL EQUIPMENT JUSTIFICATION AND APPROVAL
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Michael R. Weekes
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Abstract
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INCREASE YIELD THROUGH MACHINE PERFORMANCE OPTIMIZATION
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Michael Sivigny
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Abstract
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DESIGNED FOR THE ENVIRONMENT CLEANING TECHNOLOGY MORE WITH LESS
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Mike Bixenman
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Abstract
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MEASUREMENT OF MATERIALS PROPERTIES OF LEAD-FREE SOLDERS FOR MODELLING REQUIREMENTS
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Milos Dusek and Christopher Hunt
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Abstract
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CHARACTERIZATION OF MECHANICAL PERFORMANCE OF SN/AG/CU SOLDER JOINTS WITH DIFFERENT COMPONENT LEAD COATINGS
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Minna Arra et al.
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Abstract
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PROCESS CHALLENGES AND SOLUTIONS FOR EMBEDDING CHIP-ON-BOARD INTO MAINSTREAM SMT ASSEMBLY
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Mukul Luthra
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Abstract
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DFX USING DPMO REDUCES THE COST OF PCB ASSEMBLY
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Neil Donga et al.
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Abstract
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QUAD FLAT PACK NO LEAD (QFN) BOARD LEVEL RELIABILITY STUDY FOR AUTOMOTIVE APPLICATIONS
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Pamela O’Brien1 and Thomas Koschmieder2
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Abstract
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HIGH PIN COUNT POWER PACKAGE FOR HIGH CURRENT, HIGH TEMPERATURE AUTOMOTIVE APPLICATIONS
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Paolo Casati et al.
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Abstract
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RELIABILITY OF 15MM, 0.65 MM PITCH MOLD ARRAY PROCESS (MAP) BALL GRID ARRAY (BGA) FOR AUTOMOTIVE APPLICATIONS
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Patrice Langford and Thomas Koschmieder
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Abstract
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OPTIMISING ASSEMBLY PROCESS TO ACCOMMODATE OSP FINISH ON PRINTED CIRCUIT BOARDS
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Paul Doyle, Dirk Eickenhorst and Werner Laub
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Abstract
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REWORK OF BGA/CSP COMPONENTS USING LEAD FREE SOLDERS
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Paul Wood
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Abstract
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DAMAGE RELATIONSHIPS FOR BGA AND CSP RELIABILITY IN AUTOMOTIVE UNDERHOOD APPLICATIONS
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Pradeep Lall et al.
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Abstract
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SIX SIGMA BUSINESS SCORECARD
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Praveen Gupta
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Abstract
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0201 TECHNOLOGY IMPLEMENTATION STRATEGY FOR CEMs
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Reggie Malli
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Abstract
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VISUAL AND X-RAY INSPECTION CHARACTERISTICS OF EUTECTIC AND LEAD FREE ASSEMBLIES
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Reza Ghaffarian, Ph.D.
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Abstract
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VIBRATION BEHAVIOR OF CSP ASSEMBLIES WITH AND WITHOUT UNDERFILL
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Reza Ghaffarian, Ph.D. and *Namsoo Kim
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Abstract
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EMBEDDING CERAMIC THICK-FILM RESISTORS AND CAPACITORS IN PRINTED CIRCUIT BOARDS
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Richard Snogren
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Abstract
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TAKING DFX TO THE NEXT LEVEL
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Richard Tormet
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Abstract
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USE OF SIX SIGMA METHODOLOGIES IN ELECTRONICS PROCESSING INDUSTRIES
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Rita Mohanty, Ph.D.
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Abstract
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LOW COST COMPUTING FOR THE SMALL BUSINESS ELECTRONICS CONTRACT MANUFACTURER
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Romeo Asuncion
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Abstract
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LEADED AND LEAD-FREE SOLDER PASTE EVALUATION SCREENING PROCEDURE
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Ronald C. Lasky, Ph.D., PE et al.
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Abstract
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EFFECTS OF THERMAL INTERFACE MATERIAL ON SOLDER JOINT RELIABILITY
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Ross Wilcoxon and Dave Hillman
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Abstract
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GETTING SMALL WITH DIP PEN NANOLITHOGRAPHY
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S. Cruchon-Dupeyrat
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Abstract
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ULTRA HIGH-TEMPERATURE PRESSURE SENSITIVE ADHESIVE FOR ELECTRONICS ASSEMBLY
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S. Jimmy Hwang, Ph.D.
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Abstract
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CASE STUDIES IN THE EVALUATION OF MOISTURE SENSITIVE LEVEL (MSL) AND RELIABILITY OF DEVICES FOR HIGH RELIABILITY (HIGH-REL) APPLICATIONS
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S. R. Martell
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Abstract
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CURE PROCESSING EFFECT ON CONDUCTIVE EPOXY ADHESIVES AS SOLDER ALTERNATIVES: CERAMIC APPLICATIONS
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S. Smith, C-M Cheng, W. O’Hara, and V. Buffa
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Abstract
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A COMPARATIVE ANALYSIS OF LEAD FREE MATERIALS AND PROCESSES USING DESIGN OF EXPERIMENTS TECHNIQUES
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Sammy Shina et al.
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Abstract
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EFFECTS OF VIA PLUGGING IN MULTILAYER PRINTED CIRCUIT BOARDS
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Santhana Satagopan and Manthos Economou
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Abstract
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MINIATURIZATION USING 3-D STACK STRUCTURE FOR SIP APPLICATIONS
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Serguei Stoukatch et al.
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Abstract
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CLEANING OUT HIGH COST OF OWNERSHIP WITH PERFORMANCE ADVANCEMENTS
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Shean R. Dalton
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Abstract
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A SIMULATION-BASED CONTROL AND ANALYSIS ARCHITECTURE FOR ELECTRONICS MANUFACTURING PROCESSES
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Sreeram Ramakrishnan et al.
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Abstract
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PROCESS OPTIMIZATION FOR MINIMIZING VOIDS IN CERAMIC DIMPLED BALL GRID ARRAYS
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Steven H. Mills et al.
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Abstract
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CALCULATING THE REAL COST OF OFFSHORE OUTSOURCING
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Susan E. Mucha
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Abstract
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AUTOMATED SELECTIVE SOLDERING OF LEAD-TIN AND LEAD-FREE SOLDERS - A COMPARATIVE STUDY USING DIODE LASER AND XENON LAMP
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Syed Naveed et al.
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Abstract
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RELIABILITY AND ENVIRONMENTAL TESTING OF BLUETOOTH MODULES
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Teijo Kuosmanen et al.
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Abstract
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EFFECTS OF SURFACE CONTAMINATION ON PRODUCT YIELD
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Terence Q. Collier
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Abstract
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IMPLEMENTATION OF SQC TECHNIQUES FOR CLOSED LOOP PROCESS CONTROL IN ELECTRONICS MANUFACTURING
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Thanigai Kumar S. Vellore et al.
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Abstract
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PB FREE / HIGH TEMPERATURE REFLOW MSL PACKAGE ASSESSMENT OF A LGA PACKAGE ALTERNATIVE FOR PORTABLE PRODUCTS
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Thomas Koschmieder and Fonzell Martin
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Abstract
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DESIGN, PERFORMANCE AND RELIABILITY OF FIVE NEW LOW COST THERMALLY ENHANCED BGA
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Tiao Zhou, Ph.D. et al.
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Abstract
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DESIGN ANALYSIS OF BOARD LEVEL SOLDER JOINT RELIABILITY FOR THERMALLY ENHANCED BGAs
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Tong Yan Tee et al.
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Abstract
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RELIABILITY COMPARISON OF LEADED, ARRAY, & LEADLESS PACKAGES ON ALTERNATIVE PWB FINISHES
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Trevor S. Bowers et al.
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Abstract
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RELIABILITY COMPARISON OF LEADED, ARRAY, & LEADLESS PACKAGES ON ALTERNATIVE PWB FINISHES
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Trevor S. Bowers et al.
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Abstract
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A STUDY OF THE ACCURACY OF COMPONENT PLACEMENT SIMULATION IN ELECTRONICS MANUFACTURING
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V. Kawli, D. Warheit and K. Srihari
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Abstract
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INNOVATIVE 3-D SOLUTIONS FOR MULTIPLE DIE PACKAGING
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Vern Solberg
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Abstract
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BALL STACK PACKAGING FOR HIGH PERFORMANCE MEMORY
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Vern Solberg, Ignacio Osorio, and Jeffrey Demmin
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Abstract
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ROLE OF HDPUG IN LEAD-FREE TRANSITION
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Vivek Gupta
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Abstract
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NON-DESTRUCTIVE ANALYSIS METHOD FOR DETECTION OF THE "BLACK PAD DEFECT" ON PCB SURFACES
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Wade E. McFaddin
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Abstract
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MANAGING WASH LINES AND CONTROLLING WHITE RESIDUE BY STATISTICAL PROCESS CONTROL
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William T. (Tim) Wright
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Abstract
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EVALUATION OF THERMALLY RELIABLE PWB SUBSTRATES
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William Varnell and Ron Hornsby
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Abstract
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NEW ELECTROMIGRATION FAILURE MODE IN FLIP CHIP SOLDER JOINTS
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Y. H. Lin et al.
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Abstract
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ACCELERATED THERMAL CYCLING OF TIN-LEAD AND LEAD-FREE SOLDER JOINTS
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Yan Qi et al.
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Abstract
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