SMTA International 2003 Proceedings

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TITLE	AUTHOR
BOARD LEVEL ASSEMBLY AND RELIABILITY CONSIDERATIONS FOR QFN TYPE PACKAGES	Ahmer Syed and WonJoon Kang	Abstract
CONSIDERATIONS IN THE DEVELOPMENT OF AN 0201 COMPONENT ASSEMBLY PROCESS	Alan Rae, Joe Renda, and Joe Belmonte	Abstract
THE EFFECT OF NITROGEN REFLOW SOLDERING IN A LEAD-FREE PROCESS	Anders Åström	Abstract
THE NEXT-GENERATION INFORMATION EXCHANGE FRAMEWORK FOR ELECTRONICS MANUFACTURING: FRAMEWORK IMPLEMENTATION PROJECT FROM THE GEORGIA INSTITUTE OF TECH	Andrew Dugenske et al.	Abstract
A COMPARISON BETWEEN POWER AND THERMAL CYCLING FOR A FC PBGA	Andrew Mawer, D. Hodges Popps, and G. Presas	Abstract
ODM OR CDM?	Bill Coker	Abstract
JOINT GROUP ON POLLUTION PREVENTION LEAD-FREE SOLDER PROJECT	Brian E. Greene	Abstract
NEMI LEAD-FREE ASSEMBLY PROJECT: COMPARISON BETWEEN PbSn AND SnAgCu RELIABILITY AND MICROSTRUCTURES	Carol Handwerker et al.	Abstract
LEAD-FREE WAVE SOLDERING - TIGHTER PROCESS WINDOWS NEED TIGHTER PROCESS CONTROLS	Chrys Shea and *Keith Howell	Abstract
REDUCING VARIATION IN OUTSOURCED SMT MANUFACTURING THROUGH THE USE OF INTELLIGENT STENCIL SYSTEMS	Chrys Shea, Valentijn Van Velthoven, and Ron Tripp	Abstract
EVALUATION OF WIRE BONDING PERFORMANCE, PROCESS CONDITIONS, AND METALLURGICAL INTEGRITY OF CHIP ON BOARD WIRE BONDS	Daniel T. Rooney, Ph.D. et al.	Abstract
MANUFACTURING AND RELIABILITY OF PB-FREE AND MIXED SYSTEM ASSEMBLIES (SNPB/PB-FREE) IN AVIONICS ENVIRONMENTS	Dave Nelson and Hector Pallavicini et al.	Abstract
IMPLICATIONS OF USING LEAD-FREE SOLDERS ON X-RAY INSPECTION OF FLIP CHIPS AND BGAS	David Bernard	Abstract
CONSIDERATIONS FOR MINIMIZING RADIATION DOSES TO COMPONENTS DURING X-RAY INSPECTION	David Bernard et al.	Abstract
EMERGING AOI TECHNOLOGY - 2004 AND BEYOND	David Doyle	Abstract
INVESTIGATION OF SOLDER/FLUX RESIDUE EFFECT ON RF SIGNAL INTEGRITY USING REAL CIRCUITS	David Geiger and Dr. Dongkai Shangguan	Abstract
RELIABILITY STUDY OF SOLDER JOINTS FOR 0201 COMPONENTS	David Geiger et al.	Abstract
TECHNICAL ASSESSMENTS AND COST ANALYSIS OF THE EMBEDDED PASSIVE TECHNOLOGIES IN THE MULTI-LAYER CIRCUIT BOARDS (Part I - Resistance)	Dominique Numakura	Abstract
TOTAL PROCESS CONTROL AND MANAGEMENT- FROM RELIABILITY, STABILITY, TRACEABILITY TO PREDICTABILITY (RSTP)	Dr. Paul P.E. Wang et al.	Abstract
EPOXY FLUX BRIDGES THE GAP TO LOW COST NO-CLEAN FLIP CHIP ASSEMBLY	Dr. Wusheng Yin et al.	Abstract
FILLED NO-FLOW UNDERFILLING - PROCESS AND MATERIALS	Dr. Wusheng Yin, Dr. H-S Hwang, and Dr. N-C Lee	Abstract
EVALUATING THE EFFECT OF SOLDER PASTE RESIDUES ON RF SIGNALS BETWEEN 5 AND 10 GHZ	Dwayne R. Shirley et al.	Abstract
NO WINNERS HERE: COVERT MONEY LOSSES IN OUTSOURCED ELECTRONICS MANUFACTURING PROGRAMS	Edwin B. Smith, III	Abstract
SOLDER JOINT RELIABILITY ASSESMENT OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER	Fay Hua et al.	Abstract
IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION	Frank Grano et al.	Abstract
FLIP CHIP ON STANDARD LEAD FRAME: LOWERING THE COST OF FLIP CHIP OWNERSHIP	Frank Juskey	Abstract
DFN, A LEAD FRAME SIP FOR WIRELESS	Frank Juskey	Abstract
DIE ATTACH REWORK - PROCESS COMPARISON	Fulvio Fontana	Abstract
USING "SIGNATURE IDENTIFICATION" FOR RAPID AND EFFECTIVE X-RAY INSPECTION OF BALL GRID ARRAYS	Gil Zweig	Abstract
2D OR NOT 2D, THAT IS THE QUESTION!	Glenn Wyllie and Mark Norris	Abstract
ALTERNATIVE LEAD FREE BALL MATERIALS WITH IMPROVED INTERFACE PROPERTIES	H.-J. Albrecht et al.	Abstract
HOW TO SOLDER NON-STANDARD CBGAs OF 1.0mm PITCH	Haoqiang Song and Zhe Liu	Abstract
ASSEMBLY ISSUES WITH MICROVIA TECHNOLOGIES	Harjinder Ladhar and Sundar Sethuraman	Abstract
APPLYING SIX SIGMA TECHNIQUES TO CONTROL SCRAP COSTS AND IMPROVE QUALITY IN SMT MANUFACTURING	Hersh Kohli and *SooBeng Khoh, Ph.D.	Abstract
CAPITAL EQUIPMENT PRODUCTION	Ian McEvoy	Abstract
LEVERAGING MAINSTREAM DESIGN & ANALYSIS TOOLS FOR MEMS	Ilya Mirman	Abstract
NEMI TIN WHISKER TEST METHOD STANDARDS	Irina Boguslavsky	Abstract
SOLDER PASTE STENCIL PRINTING PERFORMANCE BASED ON STENCIL AND SOLDER PASTE TECHNOLOGY	James Adriance et al.	Abstract
EVALUATION OF LEAD-FREE SOLDER BONDS AND EFFECTS OF THE LEAD-FREE PROCESS ON DEVICES USING ACOUSTIC MICRO IMAGING	Janet E. Semmens	Abstract
THERMALLY INDUCED OUT OF PLANE DEFORMATION ANALYSIS FOR A FLIP CHIP ON FLEX 35MM TBGA	Jennifer Muncy et al.	Abstract
USE OF SUBSTRATE ETCHBACK TECHNOLOGY AND ROTATED DIE PLACEMENT TO ACHIEVE HIGH DENSITY INTERCONNECT	Jesse Phou	Abstract
IN SEARCH OF THE PERFECT BOM	Jim Arnold	Abstract
SOLID-METAL THERMAL COLUMNS IN CONVENTIONAL PCBs	Jim Fraivillig	Abstract
BLACK PAD DEFECT: INFLUENCE OF GEOMETRY AND OTHER FACTORS	Jodi Roepsch, Robert Champaign, and Barbara Waller	Abstract
IMPROVING THE ACCEPTANCE OF FLIP CHIP	John Davis et al.	Abstract
TOWARDS WAFER-SCALE MEMS PACKAGING: A REVIEW OF RECENT ADVANCES	John Heck and Steve Greathouse	Abstract
CLEANING NEW SOLDER PASTE FORMULATIONS WITH A UNIQUE LOW-VOC AQUEOUS CLEANING AGENT	John R. Sanders et al.	Abstract
THE DEVELOPMENT OF ADVANCED X-RAY INSPECTION	Jon C. Dupree	Abstract
EMERGING TRENDS IN SELECTIVE SOLDERING TECHNOLOGY	Jonathan Wol and Adrian De’ath	Abstract
AN EXAMINATION OF 'DRY BOX' DESICCANT STORAGE WITHIN THE PCB MANUFACTURING ENVIRONMENT	Kevin McCarten	Abstract
EFFECT OF PRINTED WIRING BOARD WARPAGE ON BALL GRID ARRAYS OVER TEMPERATURE	Kyra Ewer and Jeffrey Seekatz	Abstract
ELECTROLESS WAFER-LEVEL REDISTRIBUTION - FURTHER DEVELOPMENT AND NEW APPROACHES FOR SYSTEM INTEGRATION	L. Boettcher et al.	Abstract
THIN ARRAY POLYMER PACKAGING FOR RF MODULES	Leo M. Higgins III, Ph.D	Abstract
INTEGRATING COMMERCIAL OFF THE SHELF PACKAGES (COTS) INTO GUIDED MISSILE SYSTEMS: THE EMMA PROGRAM	Leopold A. Whiteman, Jr.	Abstract
ORGANIC FLIP CHIP PACKAGING DESIGN AND MANUFACTURING CHALLENGES	Louis Liu et al.	Abstract
EVALUATION OF SEMICONDUCTOR PACKAGE RELIABILITY WITH FOUR METAL LAYER PLASTIC BALL GRID ARRAY LAMINATE SUBSTRATES	Lucy Grace Dearce et al.	Abstract
SELECTIVE SOLDERING WITH LEAD-FREE ALLOYS	Marc Dalderup et al.	Abstract
LEAD-FREE CARD ASSEMBLY AND REWORK FOR COLUMN GRID ARRAYS	Marie Cole et al.	Abstract
FEASIBILITY ANALYSIS METHODOLOGY FOR STACKED-DIE VS. SINGLE-DIE PACKAGE CONSIDERATIONS	Mark Gerber and Shawn O’Connor	Abstract
LONG TERM RELIABILITY OF 0.8MM PITCH BGA PACKAGES DOUBLE-SIDE MOUNTED ON A THIN PRINTED CIRCUIT BOARD	Mark Logterman et al.	Abstract
SOLDER JOINTS FOR HIGH TEMPERATURE ELECTRONICS	Mathias Nowottnick et al.	Abstract
HAND PLACING LEADLESS AND FINE PITCH LEADED COMPONENTS WITH SIPAD SOLID SOLDER DEPOSITION	Matthew J. Kehoe	Abstract
INTEGRATION OF AOI IN A TOTAL QUALITY MANAGEMENT PROGRAM	Matthew T. Holzmann	Abstract
EVALUATION, OPTIMIZATION, AND RELIABILITY OF NO-FLOW UNDERFILL PROCESS	Michael Colella	Abstract
CAPITAL EQUIPMENT JUSTIFICATION AND APPROVAL	Michael R. Weekes	Abstract
INCREASE YIELD THROUGH MACHINE PERFORMANCE OPTIMIZATION	Michael Sivigny	Abstract
DESIGNED FOR THE ENVIRONMENT CLEANING TECHNOLOGY MORE WITH LESS	Mike Bixenman	Abstract
MEASUREMENT OF MATERIALS PROPERTIES OF LEAD-FREE SOLDERS FOR MODELLING REQUIREMENTS	Milos Dusek and Christopher Hunt	Abstract
CHARACTERIZATION OF MECHANICAL PERFORMANCE OF SN/AG/CU SOLDER JOINTS WITH DIFFERENT COMPONENT LEAD COATINGS	Minna Arra et al.	Abstract
PROCESS CHALLENGES AND SOLUTIONS FOR EMBEDDING CHIP-ON-BOARD INTO MAINSTREAM SMT ASSEMBLY	Mukul Luthra	Abstract
DFX USING DPMO REDUCES THE COST OF PCB ASSEMBLY	Neil Donga et al.	Abstract
QUAD FLAT PACK NO LEAD (QFN) BOARD LEVEL RELIABILITY STUDY FOR AUTOMOTIVE APPLICATIONS	Pamela O’Brien1 and Thomas Koschmieder2	Abstract
HIGH PIN COUNT POWER PACKAGE FOR HIGH CURRENT, HIGH TEMPERATURE AUTOMOTIVE APPLICATIONS	Paolo Casati et al.	Abstract
RELIABILITY OF 15MM, 0.65 MM PITCH MOLD ARRAY PROCESS (MAP) BALL GRID ARRAY (BGA) FOR AUTOMOTIVE APPLICATIONS	Patrice Langford and Thomas Koschmieder	Abstract
OPTIMISING ASSEMBLY PROCESS TO ACCOMMODATE OSP FINISH ON PRINTED CIRCUIT BOARDS	Paul Doyle, Dirk Eickenhorst and Werner Laub	Abstract
REWORK OF BGA/CSP COMPONENTS USING LEAD FREE SOLDERS	Paul Wood	Abstract
DAMAGE RELATIONSHIPS FOR BGA AND CSP RELIABILITY IN AUTOMOTIVE UNDERHOOD APPLICATIONS	Pradeep Lall et al.	Abstract
SIX SIGMA BUSINESS SCORECARD	Praveen Gupta	Abstract
0201 TECHNOLOGY IMPLEMENTATION STRATEGY FOR CEMs	Reggie Malli	Abstract
VISUAL AND X-RAY INSPECTION CHARACTERISTICS OF EUTECTIC AND LEAD FREE ASSEMBLIES	Reza Ghaffarian, Ph.D.	Abstract
VIBRATION BEHAVIOR OF CSP ASSEMBLIES WITH AND WITHOUT UNDERFILL	Reza Ghaffarian, Ph.D. and *Namsoo Kim	Abstract
EMBEDDING CERAMIC THICK-FILM RESISTORS AND CAPACITORS IN PRINTED CIRCUIT BOARDS	Richard Snogren	Abstract
TAKING DFX TO THE NEXT LEVEL	Richard Tormet	Abstract
USE OF SIX SIGMA METHODOLOGIES IN ELECTRONICS PROCESSING INDUSTRIES	Rita Mohanty, Ph.D.	Abstract
LOW COST COMPUTING FOR THE SMALL BUSINESS ELECTRONICS CONTRACT MANUFACTURER	Romeo Asuncion	Abstract
LEADED AND LEAD-FREE SOLDER PASTE EVALUATION SCREENING PROCEDURE	Ronald C. Lasky, Ph.D., PE et al.	Abstract
EFFECTS OF THERMAL INTERFACE MATERIAL ON SOLDER JOINT RELIABILITY	Ross Wilcoxon and Dave Hillman	Abstract
GETTING SMALL WITH DIP PEN NANOLITHOGRAPHY	S. Cruchon-Dupeyrat	Abstract
ULTRA HIGH-TEMPERATURE PRESSURE SENSITIVE ADHESIVE FOR ELECTRONICS ASSEMBLY	S. Jimmy Hwang, Ph.D.	Abstract
CASE STUDIES IN THE EVALUATION OF MOISTURE SENSITIVE LEVEL (MSL) AND RELIABILITY OF DEVICES FOR HIGH RELIABILITY (HIGH-REL) APPLICATIONS	S. R. Martell	Abstract
CURE PROCESSING EFFECT ON CONDUCTIVE EPOXY ADHESIVES AS SOLDER ALTERNATIVES: CERAMIC APPLICATIONS	S. Smith, C-M Cheng, W. O’Hara, and V. Buffa	Abstract
A COMPARATIVE ANALYSIS OF LEAD FREE MATERIALS AND PROCESSES USING DESIGN OF EXPERIMENTS TECHNIQUES	Sammy Shina et al.	Abstract
EFFECTS OF VIA PLUGGING IN MULTILAYER PRINTED CIRCUIT BOARDS	Santhana Satagopan and Manthos Economou	Abstract
MINIATURIZATION USING 3-D STACK STRUCTURE FOR SIP APPLICATIONS	Serguei Stoukatch et al.	Abstract
CLEANING OUT HIGH COST OF OWNERSHIP WITH PERFORMANCE ADVANCEMENTS	Shean R. Dalton	Abstract
A SIMULATION-BASED CONTROL AND ANALYSIS ARCHITECTURE FOR ELECTRONICS MANUFACTURING PROCESSES	Sreeram Ramakrishnan et al.	Abstract
PROCESS OPTIMIZATION FOR MINIMIZING VOIDS IN CERAMIC DIMPLED BALL GRID ARRAYS	Steven H. Mills et al.	Abstract
CALCULATING THE REAL COST OF OFFSHORE OUTSOURCING	Susan E. Mucha	Abstract
AUTOMATED SELECTIVE SOLDERING OF LEAD-TIN AND LEAD-FREE SOLDERS - A COMPARATIVE STUDY USING DIODE LASER AND XENON LAMP	Syed Naveed et al.	Abstract
RELIABILITY AND ENVIRONMENTAL TESTING OF BLUETOOTH MODULES	Teijo Kuosmanen et al.	Abstract
EFFECTS OF SURFACE CONTAMINATION ON PRODUCT YIELD	Terence Q. Collier	Abstract
IMPLEMENTATION OF SQC TECHNIQUES FOR CLOSED LOOP PROCESS CONTROL IN ELECTRONICS MANUFACTURING	Thanigai Kumar S. Vellore et al.	Abstract
PB FREE / HIGH TEMPERATURE REFLOW MSL PACKAGE ASSESSMENT OF A LGA PACKAGE ALTERNATIVE FOR PORTABLE PRODUCTS	Thomas Koschmieder and Fonzell Martin	Abstract
DESIGN, PERFORMANCE AND RELIABILITY OF FIVE NEW LOW COST THERMALLY ENHANCED BGA	Tiao Zhou, Ph.D. et al.	Abstract
DESIGN ANALYSIS OF BOARD LEVEL SOLDER JOINT RELIABILITY FOR THERMALLY ENHANCED BGAs	Tong Yan Tee et al.	Abstract
RELIABILITY COMPARISON OF LEADED, ARRAY, & LEADLESS PACKAGES ON ALTERNATIVE PWB FINISHES	Trevor S. Bowers et al.	Abstract
RELIABILITY COMPARISON OF LEADED, ARRAY, & LEADLESS PACKAGES ON ALTERNATIVE PWB FINISHES	Trevor S. Bowers et al.	Abstract
A STUDY OF THE ACCURACY OF COMPONENT PLACEMENT SIMULATION IN ELECTRONICS MANUFACTURING	V. Kawli, D. Warheit and K. Srihari	Abstract
INNOVATIVE 3-D SOLUTIONS FOR MULTIPLE DIE PACKAGING	Vern Solberg	Abstract
BALL STACK PACKAGING FOR HIGH PERFORMANCE MEMORY	Vern Solberg, Ignacio Osorio, and Jeffrey Demmin	Abstract
ROLE OF HDPUG IN LEAD-FREE TRANSITION	Vivek Gupta	Abstract
NON-DESTRUCTIVE ANALYSIS METHOD FOR DETECTION OF THE "BLACK PAD DEFECT" ON PCB SURFACES	Wade E. McFaddin	Abstract
MANAGING WASH LINES AND CONTROLLING WHITE RESIDUE BY STATISTICAL PROCESS CONTROL	William T. (Tim) Wright	Abstract
EVALUATION OF THERMALLY RELIABLE PWB SUBSTRATES	William Varnell and Ron Hornsby	Abstract
NEW ELECTROMIGRATION FAILURE MODE IN FLIP CHIP SOLDER JOINTS	Y. H. Lin et al.	Abstract
ACCELERATED THERMAL CYCLING OF TIN-LEAD AND LEAD-FREE SOLDER JOINTS	Yan Qi et al.	Abstract

SMTA International 2003 Proceedings

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