2003 Academic Student Compendium Proceedings
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|Issues in Assembly and Reliability of High I/O (1500+) Flip Chip BGAs||Arun Gowda and Dr. K. Srihari||Abstract|
|Wafer Applied Reworkable Underfill for Direct Chip Attach||Renzhe Zhao and R. Wayne Johnson||Abstract|
|Cost Savings Using Design for Environment in the Electronic Packaging Industry||Xu Yuliang and James Bartlett||Abstract|