2003 Academic Student Compendium Proceedings

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Issues in Assembly and Reliability of High I/O (1500+) Flip Chip BGAs Arun Gowda and Dr. K. Srihari  Abstract
Wafer Applied Reworkable Underfill for Direct Chip Attach Renzhe Zhao and R. Wayne Johnson  Abstract
Cost Savings Using Design for Environment in the Electronic Packaging Industry Xu Yuliang and James Bartlett  Abstract
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