SMTA China South 2017 Proceedings

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Electrochemical Migration - How Field Failures Occur and How To Avoid Them Albert Liu  Abstract
Dielectric Material Characterization for the PCB Pad Cratering Resistance Cheng-Chih Chen, Jeffrey Chang-Bing Lee, Dem Lee, Cherie Chen  Abstract
Voiding Control at LED Die Attach Preform Soldering Dr. Arnab Dasgupta, Elaina Zito, and Dr. Ning-Cheng Lee  Abstract
Flip Chip LED Assembly by Solder Stamping/Pin-Transfer Gyan Dutt, Srinath Himanshu, Nicholas Herrick, Amit Patel & Ranjit Pandher  Abstract
The Study of Cure Percentage Determination for Anisotropic Conductive Film by FTIR Method Henley Zhou, Ivan Lin, Xin Ling, Jumbo Huang, Arnel Camacho, Ranilo Aranda, Jinsuo Guo, RSivam VRajoo, and Mike Doiron  Abstract
Failure Analysis Case Study of MLCC Component Crack with Application of FEA and Bend Test Henley Zhou, Kerwin Wang, Billy Liu, Jimmy Chen, Apitak Promson, Arnel Camacho, Alex Xie, Michael Sumalinog, Ranilo Aranda, GP Li, RSivam VRajoo, Mike Doiron  Abstract
Comparing The Performance of Engineered Tin/Copper Alloys In Selective Soldering Jason Fullerton and Chris Colindres  Abstract
Assessment of Solder Paste Technology Limitation at Miniaturization for SIP and SMT Application Joanna Keck and Ning-Cheng Lee  Abstract
Qualification Test for Creep Corrosion Using Flower of Sulfur Chamber Prabjit Singh, Dem Lee, Jeffrey Lee, Karlos Guo, Julie Liu, Simon Lee, Geoffrey Tong, Chen Xu, Haley Fu  Abstract
Lights Out Electronics Assembly Ranko Vujosevic, Ph.D.  Abstract
Failure Analysis Methods Research and Quality Control on Nickel Corrosion of ENIG Solder Joints Shenzhen Kaifa Technology Co., LTD  Abstract
Low Insertion Force Compliant Pin Connector Assembly Challenge and Solution Theron Lewis, Wayne Zhang, Ben Wu, Robin Hou, Queena Zhao, Kiwi Yu, Alec Chen, Byron Tan, Jimmy Zhao, and Timothy Jennings  Abstract
The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance Timothy O'Neill, Carlos Tafoya and Gustavo Ramirez  Abstract
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