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TITLE
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AUTHOR
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SPECIAL ISSUES IN 3D-MICROELECTRONICS INTERNAL COUPLINGS
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A. Brandolini, A. Gandelli and R.E. Zich
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Abstract
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CHALLENGES IN LEAD-FREE REWORK
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Arun Gowda
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Abstract
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MECHANICAL RELIABILITY OF UNDERFILLED CSP ASSEMBLIES
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Arun Gowda et al.
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Abstract
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PRODUCT COST ESTIMATION USING ACTIVITY-BASED COSTING
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Ashish Tarhalkar & K. Srihari, Ph.D.
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Abstract
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A SIMPLIFIED REFLOW SOLDERING PROCESS MODEL
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David C. Whalley
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Abstract
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ULTRA HIGH Q INDUCTOR AND RF INTEGRATED PASSIVE DEVICES ON THICK OXIDE SI SUBSTRATE
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Dong-Wook Kim et al.
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Abstract
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A LOW COST RELIABILITY ASSESSMENT FOR DOUBLE-SIDED MIRROR-IMAGED FLIP CHIP BGA ASSEMBLIES
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Dr. A.C. Shiah and Xiang Zhou
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Abstract
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OPTOELECTRONICS - ADDING A LITTLE LIGHT TO THE NANO-WORLD
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Dr. Ken Gilleo
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Abstract
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AFFORDABLE 'STRUCTURES' FOR LOW VOLUME PRODUCTION
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Dr. Ramesh Sharma
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Abstract
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PREDICTIVE MODELING OF THERMALLY INDUCED STRESSES IN MICROELECTRONIC AND PHOTONIC STRUCTURES: ROLE, ATTRIBUTES, REVIEW
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E. Suhir
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Abstract
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FACTORS AFFECTING VOIDING IN UNDERFILLED FLIP CHIP ASSEMBLIES
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George Carson, PhD and Maury Edwards
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Abstract
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A STUDY OF MICROSTRUCTURAL CHANGE OF LEAD-CONTAINING AND LEAD FREE SOLDERS
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Hans-Jurgen Albrecht
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Abstract
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DEVELOPMENT OF HIGH DENSITY PRINTED WIRING BOARD WITH FINE STACKED VIA HOLES
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Hideki Higashitani et al.
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Abstract
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ENCAPSULATION TECHNOLOGY FOR 3D STACKED PACKAGES
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Horatio Quinones et al.
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Abstract
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ENHANCED SCANNING ACOUSTIC MICROSCOPY THROUGH F-SCAN IMAGING
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James C.P. McKeon
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Abstract
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LEAD-FREE SOLDER BOND EVALUATION USING ACOUSTIC MICRO IMAGING (AMI)
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Janet E. Semmens
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Abstract
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ACOUSTIC MICRO IMAGING IN THE FOURIER DOMAIN FOR EVALUATION OF ADVANCED PACKAGING
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Janet E. Semmens and Lawrence W. Kessler
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Abstract
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PROCESS QUALIFICATION STRATEGIES FOR FLIP CHIP IN THE EMS ENVIRONMENT
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Jeff Kennedy
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Abstract
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ELECTRICAL CHARACTERIZATION OF LEAD-FREE SOLDER SEPARABLE CONTACT INTERFACES
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Ji Wu, Michael Pecht et al.
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Abstract
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BALL SHEAR STRENGTH OF 63Sn-37Pb SOLDER BUMP WITH TEST CONDITIONS
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Jin-Won Choi, Jae-Hoon Choi, and Tae-Sung Oh
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Abstract
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PATTERNING THREE-DIMENSIONAL STRUCTURES ON WAFERS WITH ELECTROPHORETIC PHOTORESIST
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John Klocke
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Abstract
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DEVELOPMENT OF A COMPLIANT SOLDER
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John Ranieri, Hsingching Crystal Hsu
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Abstract
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DESIGN CHALLENGES IN SMT TERMINAL BLOCK DESIGN
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Jonathan France
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Abstract
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MULTICHIP MODULE ON SILICON FOR SAW FILTER EMBEDDED RF RECEIVER
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Jong-Soo Lee et al.
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Abstract
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CAPACITY REQUIREMENTS PLANNING IN A HIGH VOLUME, MEDIUM/HIGH MIX EMS PROVIDER'S ENVIRONMENT
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K. Srihari, Ph.D.
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Abstract
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mBGA's SOLDER & OVEN PROFILES - CRITICAL PROCESS VARIABLES
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Kathleen S. Palumbo
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Abstract
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STUDY ON LOW-STRESS FLIP CHIP PACKAGING USING ADVANCED NON CONDUCTIVE PASTE (ANCP)
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Kenichi Suzuki et al.
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Abstract
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CSP FLUX-FREE UNDERFILL RESIN FOR ELECTRICAL CONNECTION AND PHYSICAL ADHESION
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Kenji Kitamura et al.
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Abstract
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THERMAL AGING RELIABILITY OF SOLDER BALL JOINT FOR SEMICONDUCTOR PACKAGE SUBSTRATE
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Kiyoshi Hasegawa et al.
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Abstract
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ADHESION AND RELIABILITY OF UNDERFILL/SUBSTRATE INTERFACES IN FLIPCHIP BGA PACKAGES: METROLOGY AND CHARACTERIZATION
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Kumar Nagarajan
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Abstract
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STUDY ON COINED SOLDER BUMPS ON PCB PADS
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Kyung W. Paik et al/
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Abstract
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MASKLESS DEPOSITION TECHNOLOGY TARGETS PASSIVE EMBEDDED COMPONENTS
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M. J. Renn, B. H. King, and M. Essien
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Abstract
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FROM BATCH TO BREAKTHROUGH: UNDERSTANDING PHASE CONVECTION TECHNOLOGY
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Mark J. Norris
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Abstract
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AUTOMATED OPTICAL INSPECTION (AOI): USING THE DATA TO ACHIEVE THE "ZERO DEFECT LINE"
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Mark J. Norris
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Abstract
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SOC VS SIP: ALTERNATIVE PATHS TO HDI (SLI)?
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Martin Goetz
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Abstract
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THERMAL PACKAGE ENHANCEMENT IMPROVES HARD DISK DRIVE DATA TRANSFER PERFORMANCE
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Michael Ko
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Abstract
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THE BUSINESS, PRODUCT LIABILITY AND TECHNICAL ISSUES ASSOCIATED WITH USING ELECTRONIC PARTS OUTSIDE THE MANUFACTURER'S SPECIFIED TEMPERATURE RANGE
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Michael Pecht
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Abstract
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DIELECTRIC CHARACTERISTICS OF ENCAPSULATION MATERIALS USED IN MICROELECTRONIC PACKAGING
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Michael Todd
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Abstract
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SOLDER JOINT STRENGTH VERSUS INSERTION, EXTRACTION AND IN-FIELD FORCES APPLIED TO A SURFACE MOUNT DEPLUGGABLE CONNECTOR
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Michel Hodak
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Abstract
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A STATISTICAL BASED STUDY FOR COMPARISON AND OPTIMIZATION OF AN ENCLOSED PRINT HEAD TECHNOLOGY
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Muffadal Mukadam et al.
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Abstract
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PROCESS CHALLENGES AND SOLUTIONS FOR EMBEDDING CHIP-ON-BOARD INTO MAINSTREAM SMT ASSEMBLY
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Mukul Luthra
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Abstract
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SMART MEMS MODULE ASSEMBLY FOR AIRCRAFT APPLICATIONS
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Namsoo P. Kim, Chung-Ping Chien, and Minas H. Tani
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Abstract
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THERMAL ENHANCEMENT OF PBGA BY HIGH THERMAL CONDUCTIVITY MOLD COMPOUND AND PACKAGE DESIGN OPTIONS
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Navas Khan et al.
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Abstract
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UNDERFILL FLOW MODELING FOR FLIP CHIP ON BOARD ASSEMBLY
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P.Venkataraman, C. Fullone, M. Ramkumar
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Abstract
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SOLDER FATIGUE RELIABILITY ISSUES IN LEAD-FREE BGA PACKAGES
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Pedro Chalco
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Abstract
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A RELIABLE FLIP-CHIP FLEX BGA WITH REFLOWABLE UNDERFILL
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Poi-Siong Teo et al.
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Abstract
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THE NEW FILM INTELLIGENT ELECTRONIC CONVERTERS USING NEW DUPONT AND ESL HIGH TECHNOLOGY MATERIALS FOR LOW POWER DISCHARGE LAMPS
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Prof. Tadeusz Sobczyk
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Abstract
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"CURING" LOW YIELDS & RELIABILITY ISSUES IN PHOTONICS ASSEMBLY
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Richard S. Garard and Bruce A. Adams
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Abstract
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INSIDER THREAT RISK MANAGEMENT FOR TRADE SECRETS AND INTELLECTUAL PROPERTY
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Richard Sheiman
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Abstract
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LINE BALANCING AND PRODUCTIVITY IMPROVEMENTS IN ELECTRONICS ASSEMBLY USING MODELING AND SIMULATION TECHNIQUES
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S. Manian Ramkumar
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Abstract
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NEW PROCESS/PRODUCT INTRODUCTION: DO IT RIGHT THE FIRST TIME
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Salim Merchant
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Abstract
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DRAM PACKAGING AND SMT ASSEMBLY OF MEMORY MODULES
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Sarah Shen and Wayne Koh
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Abstract
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AN INVESTIGATION ON COPPER CONDUCTIVE PASTE FOR HDIIVH SUBSTRATES
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Shen-Li Fu et al.
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Abstract
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DEVELOPMENT OF A CLOSELY DUCTED HEATSINK COOLING SOLUTION FOR AN ARRAY OF PARALLEL PROCESSORS
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Steven J. Young and Julius Caesar T. Zerna
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Abstract
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MIL/AERO MEMS: BENEFITS AND BARRIERS
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Tom Clifford
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Abstract
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X-RAY INSPECTION ... AVOID RADIATION DAMAGE
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Tom Clifford
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Abstract
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DEVELOPMENT OF SHORTENING PROCESS TIME IN SBB
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Toshiyuki Kojima et al.
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Abstract
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STACKED MULTI-CHIP PACKAGING FOR THE NEXT GENERATION ELECTRONICS
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Vern Solberg
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Abstract
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THIN FILM EMBEDDED PASSIVES FOR MICROWAVE AND MILLIMETER WAVE APPLICATIONS
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W. de Raedt, E. Beyne, R. Mertens
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Abstract
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PERSPECTIVES ON DIGITAL CONSUMER GOODS AND SYSTEM LSI
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Yukio Furuta
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Abstract
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