Pan Pacific Symposium 2018 Proceedings

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Selected Highlights from the 2017 INEMI Roadmap and Projects to Address Identified Gaps Bill Bader and Chuck Richardson  Abstract
Ipc-1782 Standard for Traceability of Critical Items Based on Risk Cameron E. Shearon, Jr  Abstract
Smart Access to Small Lot Manufacturing For Systems Integration Dag R. Andersson, et al.  Abstract
Oxygen Vacancy Migration in Mlccs Dock Brown  Abstract
Enhanced Driver Safety with Advanced Vision Systems Dwight Howard  Abstract
Integrated Intelligent Transportation and Key Enablers Dwight Howard  Abstract
Inemi Project on Process Development Of Bisn-Based Low Temperature Solder Pastes – Part II: Characterization of Mixed Alloy Bga Solder Joints Haley Fu, Raiyo Aspandiar, Jimmy Chen, Shunfeng Cheng, Qin Chen, Richard Coyle, Sophia Feng, Bill Hardin, Mark Krmpotich, Scott Mokler, Jagadeesh Radhakrishnan, Morgana Ribas, Brook Sandy-Smith, Kok Kwan Tang, Greg Wu, Anny Zhang and Wilson Zhen  Abstract
Pb-Free Solders and Other Joining Materials For Potential Replacement of High-Pb Hierarchical Solders Iver E. Anderson, Stephanie Choquette, Kathlene (Thomas) Reeve and Carol Handwerker  Abstract
Uniformity Consideration in Capacitively Coupled Plasma Part 1 Jack Zhao, Ph.D. and Youqing Tang  Abstract
Recent Applications of Fourier Domain Imaging of Microelectronic Devices Janet E. Semmens  Abstract
Impact on Water Cooled Heatsink Design from SMT Component Movement during Reflow Joe Fuller  Abstract
Etching Behaviors of Galvanic Coupled Metals in Pcb Applications Jong-Chan Choi, Yong-Soo Lee, Jinuk Lee, Hyun-Woo Kwon and Jae-Ho Lee  Abstract
Intermetallic Compound Formation and Mechanical Property of Sn-Cu-Xcr/Cu Lead-Free Solder Joint Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Hiroshi Nishikawa and Chang-Woo Lee  Abstract
Robotic Soldering of Lead Free Alloys Kar Lin Chia, Ban Leong Choo, Sooi Jin Lee, Cynthia Tan Sok Luang, Ming Siew Tan and Thomas Truman  Abstract
Advances in Computer Tomography (3d) For Demanding Electronics Applications Keith Bryant  Abstract
Process, Geometry and Stack Related Reliability Of Thick Alcu-Metal-Tracks Kirsten Weide-Zaage and Verena Hein  Abstract
“New Automotive” – Considerations for Reliability, Robustness and Resilience For Cmos Interconnects Kirsten Weide-Zaage, Hélène Frémont, Ph.D. and Verena Hein  Abstract
A Study on the Novel Anchoring Polymer Layer(Apl) Anisotropic Conductive Films(Acfs) for Ultra Fine Pitch Assembly Applications Kyung-Wook Paik and Dal-Jin Yoon  Abstract
Packaging Meets Heterogeneous Integration Driving Direction for Advanced System in Packages M. Juergen Wolf, Wolfram Steller and Klaus-Dieter Lang  Abstract
Resistivity-Strain Analysis of Graphene-Based Ink Coated Fabrics for Wearable Electronics M. Simard-Normandin, Q.-B. Ho, R. Rahman, S. Ferguson and K. Manga  Abstract
Cleanliness Testing for Process Acceptability Mark McMeen, Jonnie Johnson, Collin Langley, Mike Bixenman, DBA and David Lober  Abstract
From Weapons to Wirebonds: How Global Security Drives Innovation, Supply and Demand Martin P. Goetz  Abstract
Development of Highly Reliable Low Temperature Curable Photosensitive Polyimide Masao Tomikawa Ph.D., Yuki Masuda, Yu Shoji, Kazuyuki Matsumura and Ryoji Okuda  Abstract
Ion Chromatography Component Specific Cleanliness Testing for Process Acceptability Mike Bixenman, DBA, David Lober, Mark McMeen and Collin Langley  Abstract
The Latest Material Technologies for System in Package Osamu Suzuki  Abstract
Design and Reliability Assessment of Stacked Fan-Out Packaging Pao-Hsiung Wang, An Huang and Kuo-Ning Chiang  Abstract
Evaluation of No-Clean Flux Residues Remaining After Secondary Process Operations Phil Isaacs, Jennifer Bennett and Terry Munson  Abstract
A Flowers of Sulfur Corrosion Chamber for Testing Electronic Hardware Prabjit Singh, Larry Palmer, Haley Fu, Dem Lee, Jeffrey Lee, Karlos Guo, Jane Li, Simon Lee, Geoffrey Tong and Chen Xu  Abstract
Heterogeneous and Homogeneous Package Integration Technologies at Device and System Levels Rao Tummala, Nithin Nedumthakady, Siddharth Ravichandran, Bartlet DeProspo and Venkatesh Sundaram  Abstract
Using Cpk and Cpk Confidence Intervals to Evaluate Stencil Printing Ronald C. Lasky, Ph.D and Christopher Nash  Abstract
Enabling Information Age through Advanced Packaging Technologies and Electronic Materials Rozalia Beica  Abstract
Long-Term Isothermally Aged Concerns for Sac Lead-Free Solder In Harsh Environment Applications Sa’d Hamasha, John L. Evans, Michael Bozack and Wayne Johnson  Abstract
The Development of Test Methodolgies for Determining The Formulations and Mechanical Properties of Leadfree Nano Solder Sammy Shina, Ph.D., P.E and Irtiza Akhtar M.S.  Abstract
Intermetallic Formation of Sn Solder on Cu-Xni for a Harsh Environment Composite Solder Paste Stephanie Choquette and Iver Anderson, Ph.D.  Abstract
Challenges in Material Selection for Sip Applications Sze-Pei Lim  Abstract
Deposit Properties of New Electroless Au/Pd/Au Process for Fine Line Application Tatsushi Someya, Tetsuya Sasamura, Ph.D., Eriko Furuya, Katsuhisa Tanabe and Shigeo Hashimoto  Abstract
Problems with Rose Testing Using Today’s Fluxes Todd Rountree and Steve Stach  Abstract
The Management of Complexity In Research and Development Verena Hein  Abstract
Fabrication of 2d And 3d Inductors for Dc-Dc Converters Integrated On Glass Interposer Vincent Lafage, Yann Beilliard, Arvind Sridhar, Thomas Brunschwiler and Dominique Drouin  Abstract
Highly Accurate Wiring Fabrication Technologies by Plasma Dry Processes for 3d-Ic and Fan-Out Packaging Yasuhiro Morikawa, Takahide Murayama, Toshiyuki Sakuishi, Muneyuki Sato, Akiyoshi Suzuki and Koukou Suu  Abstract
Influence of Electroless Pd Plating Film Thickness on Solder Ball Joint Reliability Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu and Kiyoshi Hasegawa  Abstract
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