SMTA China East 2017 Proceedings

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TITLE AUTHOR
Stencil Aperture Area Ratio Extension – Impact of Stencil Technology and Coating Benjamin Chang, Tim C.C. Pan, Louis Yang, Srini Aravamudhan, Tzee Sing Mak, Shuh An Moy  Abstract
Surface Insulation Resistance of No-Clean Flux Residues Under Various Surface Mount Components Bruno Tolla, Ph.D., Denis Jean, Kyle Loomis, Yanrong Shi, Ph.D.  Abstract
The Study of the Effect of PTH diameter, Connection Type and Amount of Connected Copper on PTH Hole Fill Percentage by Wave Soldering David Geiger, Henley Zhou, Arnel Camacho, Jumbo Huang, Jiewei Lu, Devon Ding, Zoe Zheng, Jimmy Chen, Michael Sumalinog, RSivam VRajoo, Mike Doiron  Abstract
Reflow Profile Repeatable and Consistency Analysis Deyou Wu  Abstract
The FEA of Compressive Stress Strain of High Speed Connector Based On The Different PCB Surface Finishes Dong Wang Qi Zheng Qian Liao Xiaofeng Chen  Abstract
Application Methods and Thermal Mechanical Reliability of Polymeric Solder Joint Encapsulation Materials (SJEM) on SnAgCu Solder Joints Jagadeesh Radhakrishnan, Sunny Lu, Al Molina, Olivia H. Chen, Wu Jin Chang, Xin Wang, Kok Kwan Tang, Scott Mokler, and Raiyo Aspandiar  Abstract
Computer Tomography from Microelectronics to Assembled Products Keith Bryant and Michael Tang  Abstract
01005/008004 Components Assembly Challenge Kenneth Thum, Jonas Sjoberg, Sze Pei Lim, Wisdom Qu, Fiona Chen  Abstract
Cleaning Agent Innovation for Highly Dense Electronic Assemblies Mike Bixenman  Abstract
Using Rheology Measurement As A Potentially Predictive Tool for Solder Paste Transfer Efficiency and Print Volume Consistency Mitch Holtzer, Karen Tellefsen and Westin Bent  Abstract
Enhanced Protection and Reliability of Harsh Environment Electronics Through Enviroment-Friendly, Insulating Conformal Coating Rakesh Kumar, Frank Ke, Angie Summers and Lamar Young  Abstract
Soldering Immersion Tin Rick Nichols and Sandra Heinemann  Abstract
Early Design Review of Boundary Scan and Test Coverage Analysis for Effective and Optimized Test Strategy Sivakumar Vijayakumar  Abstract
Progress in Low Temperature Lead-free Solder for SMT Assembly Wayne Koh, PhD  Abstract
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