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AUTHOR
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Investigating Test Methods For Electrochemical Consistency In PCB Assembly Processes
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Brook Sandy-Smith
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Abstract
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Conformal Coatings And Their Impact On QFN Reliability
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C Yin, S Stoyanov, C Bailey and P Stewart, S McCallum
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Abstract
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Impact Of Wide Band Gap Devices On Power Electronics Packaging Designs
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C. Bailey, P. Rajaguru, H. Lu
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Abstract
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AXI Inspection Study With Heavily Shielded Press-Fit Connectors (IMPEL)
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Chin Weng Tan, Yoke Hong Tan, Alvinkw Leong, Sreedharan Kelappen Kanaran, Zhen (Jane) Feng, Ph. D., David Geiger, Patrick Tan, YK Chan, Jim Lin and KT Tan
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Abstract
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Temporary Wafer Bonding-Key Technology For Mems Devices
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Dirk Wuensch¹, Lina Purwin¹, Lars Büttner¹, Ronny Martinka¹, Ina Schubert¹, Romy Junghans¹, Mario Baum¹, Maik Wiemer¹, Thomas Otto¹,²
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Abstract
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A Fast Pneumatic Droplet Generator For The Ejection of Molten Aluminum
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Dominik Rumschoettel, Benjamin Griebel, Franz Irlinger and Tim C. Lueth
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Abstract
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“Shift-Left”: Rapid Electronics Design With Advanced Tools And Optimized Workflow
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Dwight Howard
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Abstract
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Intelligent Manufacturing Automation
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Horatio Quinones, Ph.D. and Yang Yong
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Abstract
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NASA-DOD Phase 3 Consortium Testing Plan For Alternate Alloys For Use On High-Reliability Products
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Jeff Kennedy and David Hilman
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Introduction to Halt-Making Your Product Robust
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John Cooper, CRE, PE
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An Overview of Reliability
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John Cooper, CRE, PE
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Abstract
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One Approach How To Reduce Data Transferring
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Kanji Otsuka Ph. D., Yoichi Sato, Fumiaki Fujii
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Abstract
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Computer Tomography From Microelectronics To Assembled Products
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Keith Bryant and Ragnar Vaga
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Abstract
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COTS- Radiation Effects Approaches And Considerations
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Kirsten Weide-Zaage, Ph.D., Philemon Eichin, Chen Chen, Yupeng Zhao, Lifan Zhao
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Abstract
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Laser Releasable Temporary Bond/DE-Bond Materials For Next 3D Packages
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Koichi Hasegawa, Ph.D., Takashi Mori, Hikaru Mizuno, Hiroyuki Ishii, Yooichiroh Maruyama, Ph.D., and Kenzo Ohkita, Ph.D.
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Abstract
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Fabric-Based Fine Pitch Interconnect Technology Using Anisotropic Conductive Films(ACFs)
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Kyung W. Paik
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Abstract
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Direct Bond Interconnect (DBI) For Fine-Pitch Bonding In 3D And 2.5D Integrated Circuits
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Liang Wang *, Gill Fountain, Bongsub Lee, Guilian Gao, Cyprian Uzoh, Scott McGrath, Paul Enquist, Sitaram Arkalgud and Laura Mirkarimi
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Abstract
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Smart Tags That Are Exactly Reliable Enough
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Maaike M. Visser Taklo, Ph.D., Branson D. Belle, Daniel Nilsen Wright, Astrid-Sofie B. Vardøy, Alexandre Garcia and Torbjörn Eriksson, Olle Hagel, Magnus Danestig
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Abstract
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Implantable Hemodynamic Controlling System With A Highly Miniaturized Two Axis Acceleration Sensor
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Mario Baum¹, Dirk Wuensch¹, Karla Hiller², Roman Forke¹, Tim Schroeder¹, Sebastian Weidlich², Susann Hahn², Danny Reuter², Maik Wiemer¹, Jens Weidenmueller³, Oezgue Dogan³ Michael Goertz³, Thomas Otto¹,²
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Abstract
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Fostering Innovation In Digital Health A New Ecosystem
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Matthew K. Hudes
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Abstract
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Reliable Micro-Electronic Assembly Process Design Test Methods - A Non-Standard Approach
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Mike Bixenman, DBA and Mark McMeen, Jason Tynes
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Abstract
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Effect of Leadership Style On Organizational Commitment
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Olayide Abosede Aina, MBA, DM and Kewal K. Verma, Ph.D.
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Abstract
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Nanoscale Profile Copper For High Speed Transmission Printed Wiring Boards
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Osamu Suzuki
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Abstract
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Volumetric Characterization of Reservoir Printing In Deep Cavities
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Phani Vallabhajosyula, Ph.D., William Coleman, Ph.D., Karl Pfluke and Mark Reece, Brook Sandy-Smith
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Abstract
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Comparison of Ionic Contamination Test Methods To Determine Their Ability To Reliably Predict Performance Risks
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Phil Isaacs, Jennifer Porto, Dave Braun and Terry Munson
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Abstract
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Process Considerations For Lead Free Assemblies
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Phil Isaacs, Kar Lin Chia, Huat Ing Poh2 & Tom Truman
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Abstract
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Influence Of Intermetallic Thickness And Elastic Modulus On Passivation Thermal Stress
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Raj Sekar Sethu and How Ung Ha, Ph.D. and Kok Heng Soon, Ph.D.
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Abstract
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Thermal Cycling Testing To Failure Of A Ceramic Column Grid Array¹ Package For Space Applications²
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Rajeshuni Ramesham, Ph.D.
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Abstract
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Future of Embedding And Fan-Out Technologies
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Rao Tummala, Ph.D; Venky Sundaram, Ph.D; Pulugurtha M. Raj, Ph.D; Vanessa Smet, Ph.D.
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Abstract
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Board Level Reliability of BGA Multichip Modules
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Robert Darveaux and Bhuvaneshwaran Vijayakumar
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Abstract
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3D IPD On Thru Glass Via Substrate Using Panel Manufacturing Technology For RF Applications
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Satoru Kuramochi1 and Hobie Yun2
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Abstract
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Defining A Quality View
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Selim S. Nahas
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Abstract
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Industry Trends In Photonics Packaging: Passive Fiber and Die Coupling
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Shalomin Thomas, Keyla Y. Bastardo, and Martin K. Anselm, Ph.D.
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Abstract
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Mixed-Signal Glass Module For IOT Applications
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Srikrishna Sitaraman¹, Tony Contreras¹, Ray Kahidi¹, Ganesh Bhatt², Terry Bowen³ and Mohammad Ahmed²
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Abstract
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Reliability Improvement Of Cu-Wire Bonded Lead Frame Package For Automotive Applications
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Tatsunori Saruwatari, Toru Takahashi, Akinori Ono, Yuichi Asano, Toshihiro Iwasaki, Mitsuru Ooida, Yoichi Hiruta
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Abstract
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Additive Metallization of Injection Molded Ceramic Components By a Plasma-Coating Process
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Thomas Braun¹, Sandra Greiner², Antonia Diepgen¹, Kerry Schröppel¹, Dietmar Drummer², Jörg Franke¹
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Abstract
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Scalable Packaging Platform Suppporting High-Performance 3D Chip Stacks
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Thomas Brunschwiler¹, Gerd Schlottig¹, Arvind Sridhar¹, Antonio La Porta¹, Ozgur Ozsun¹, Jonas Zürcher¹, Rahel Strässle¹, Luca Del Carro¹ and Pedro A. M. Bezerra²
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Abstract
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Influences On Crack Initiation In Conductor Tracks On Three-Dimensional Thermoplastic Substrates
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Thomas Kuhn and Jörg Franke
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Abstract
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Wafer-level Fabricated High-Performance Micro/Nano Gas Sensor
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Tie Li, Ph.D., Lei Xu, Ph.D., Le Luo, Ph.D., and Yuelin Wang, Ph.D.
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Abstract
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Reinforced Solder Preforms For High-Reliability And Low Voiding
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Tim Jensen, Sunny Neoh, and Adam Murling
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Abstract
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Void Reduction In Reflow Soldering Processes By Sweep Stimulation of PCB Substrate-Influence of Solder Paste
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Viktoria Rawinski
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Abstract
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Atomic Level INP/SI Wafer-Scale Direct Bonding In Low Temperature
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Xuan Xiong Zhang
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Abstract
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High-Density Via Fabrication Technology Solution For Heterogeneous Integration
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Yasuhiro Morikawa, Takahide Murayama, Toshiyuki Sakuishi, Muneyuki Sato and Akiyoshi Suzuki
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Abstract
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Solder Ball Joint Reliability With Electronics NI/PD/AU Plating-Influence Of Electroless PD Deposition Reaction Process And Electroless PD Film Thickness
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Yoshinori Ejiri, Kunihiko Akai, Yasushi Sugimoto, Kiyoshi Hasegawa
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Abstract
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