South East Asia Technical Training Conference on Electronics Assembly Technologies 2016 Proceedings

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Novel Thermally Conductive Low Pressure Overmold Materials as a Solution for Thermal Management Callum Poole, M.Eng  Abstract
An Optimized Assembly Solution for Surface Mount Led Module ChinFei Ng, Shirley Ng and Patrick Aun  Abstract
Robust Design of PCB Asembly Process for XSON Package ChinFei Ng, Shirley Ng and Patrick Aun  Abstract
Readability of Directly- Marked Traceability Symbols on PCBs Christoph Wimmer, Steven Moser, Tim O’Neel, Leah Sun Zhen  Abstract
Impact of Unfavorable Data Center Environments on Hard Disk Drive Reliability Dave Verburg and Feng Gao  Abstract
Reliability Assessment of No-Clean and Water-Soluble Solder Pastes Part II Emmanuelle Guéné and Steven Teh  Abstract
The Risk and Solution for No-Clean Flux Not Fully Dried Under Component Terminations Fen Chen and Ning-Cheng Lee, Ph.D.  Abstract
SSD's Reliability Failure Mode and It's Supercapacitor Failure Feng Gao and Dave Verburg  Abstract
Led Die Attach-Trends & Considerations Gyan Dutt and Ravi Bhatkal  Abstract
Large Panel Wafer Level Packaging John Almiranez  Abstract
High-Density Assembly and Root Cause Analyses Jonas Sjoberg , Chris Nash, David Sbiroli and Wisdom Qu  Abstract
Recent Technology Advances In X-Ray Inspection For Yield Improvement Keith Bryant and Frieldhelm Maur  Abstract
HnP Defects by Emulating The Gap Between BGA and PCB During Reflow Ken Chiavone and HT Poh  Abstract
Printing Capability Study of 008004 (0201 m) Components for Sip Applications Kenneth Thum; Jonas Sjoberg; Sze Pei Lim, Wisdom Qu; Fiona Chen  Abstract
Manufacturing Test Time Optimization Case Study: By The Six Sigma Dmaic Process Lee Kong Hui and Jason Ho  Abstract
The Development of a 0.3mm Pitch CSP Assembly Process Part 2: Assembly & Reliability Mark Whitmore and Jeff Schake  Abstract
Placing Sensors Under Bottom Termination Test Boards Provides an Accurate Risk Assessment for Board Cleanliness Mike Bixenman, DBA, David Lober,Mark McMeen and Jason Tynes  Abstract
Methods of Reducing or Eliminating Voids In BGA And BTC Devices Mitch Holtzer and T.W. Mok  Abstract
Application of the Fundamentals Based Problem Solving on Bond Pad Contamination Mun Leong Loke  Abstract
The Use of Complex Alloys to Achieve High Reliability Lead Free Solder Joints Neil Poole, Ph.D.  Abstract
High reliability Interconnects for High Power LED Assembly Ravi M. Bhatkal, Ph.D., Amit Patel and Ranjit Pandher, Ph.D.  Abstract
PH Neutral Cleaning Agents- Market Expectation & Field Performance Umut Tosun, M.S.Chem.Eng., Jigar Patel, M.S.Chem.Eng., Kalyan Nukala, M.S.Chem.Eng. and Fernando Gazcon  Abstract
High Reliability Sinterable Interface Joint Materials for Next Generation Microelectronic Assembly Vivek Dutta and Michael Matthews  Abstract
Novel Lead-Free Solder Alloys Development for Automotive Applications Weiping Liu, Ph.D. and Ning-Cheng Lee, Ph.D.  Abstract
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