International Conference on Soldering & Reliability 2014 Proceedings

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Intermediate and High Strain-Rate Fracture of Lead-Free Solder Joints as a Function of Mode Ratio Amir Nourani and Jan K. Spelt  Abstract
Microstructure and Hardness of Bi-Containing Solder Alloys After Solidification and Ageing André Delhaise, Leonid Snugovsky, Doug Perovic, Polina Snugovsky, Eva Kosiba  Abstract
Application of the Flowers of Sulfur Test to the Turbini Corrosion Coupon Bev Christian, Ph.D., Ahmed Eltom and Deepchand Ramjattan  Abstract
Quantifying the Improvements in the Solder Paste Printing Process from Stencil Nanocoatings and Engineered Under Wipe Solvents Chrys Shea, Mike Bixenman, Debbie Carboni, Brook Sandy-Smith, Greg Wade, Ray Whittier, Joe Perault, and Eric Hanson  Abstract
Micro-Alloying Effects on Joint Microstructures in Sn-Ag-Cu Solder Joints for High Reliability In Thermal Cycling Dave Hillman and Iver Anderson, Ph.D.  Abstract
Rinsing Study to Determine Process Factors for Removing Cleaning Agent from Bottom Terminations David Lober, Mike Bixenman, Ph.D., Ram Wissel & Jason Chan  Abstract
The Use of Complex Alloys to Achieve High Reliability Lead Free Solder Joints Dr. Neil Poole  Abstract
Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes Edward Briggs  Abstract
Non-Functional Pads: Should They Stay or Should They Go? Greg Caswell, Cheryl Tulkoff  Abstract
Impact of Process Control in Pb-Free to SnPb Reballing Techniques Part 1: Control of Thermal Exposure Joelle Arnold, Seth Binfield, Steph Gulbrandsen, and Dr. Nathan Blattau  Abstract
Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin Whisker Mitigation Junghyun Cho, Stephan J. Meschter, Suraj Maganty, Dale Starkey, Mario Gomez, David G. Edwards, Abdullah Ekin, Kevin Elsken, Jason Keeping, Polina Snugovsky, Jeff Kennedy, and Marianne Romansky  Abstract
SIR Measurements During Modified Automotive Damp Heat Cycling: Solder Paste and Conformal Coating Compatibility Karen Tellefsen and Mitch Holtzer, Prof. Dr.-Ing. Marcus Reichenberger  Abstract
A Case Study of First-Level Die Attach with Nano-Ag Paste Keith Howell, Takatoshi Nishimura, Keith Sweatman, Tetsuro Nishimura, Teruo Komatsu  Abstract
The Effects of Water Soluble Paste Formulation on the Ball Attach and Ball Shear Failure Li Tianpeng, Jorcelyn Tan Ying Ru, C. D. Breach and A. Hawkins  Abstract
Effect of Reflow Time on Wetting Behavior, Interfacial Reaction and Shear Strength of Sn–0.3Ag-0.7Cu Solder/Cu Joint Mrunali Sona and K. Narayan Prabhu  Abstract
New Lead-Free Alloy for High Reliabilty, High Operating Temperature Applications Pritha Choudhury, Morgana Ribas, Anil Kumar, Sutapa Mukherjee, Siuli Sarkar, Ranjit Pandher, Rahul Raut, Bawa Singh, and Ravi Bhatkal  Abstract
Eliminating BTC Voiding on the Fly: In-Production Optimization Techniques Rafael Padilla, Kazuyori Takagi, Ko Inaba, Satoru Akita, Derek Daily, Tokuro Yamaki, Hideki Mori, Tomoyasu Yoshikawa and Masato Shimamura  Abstract
Fracture Performance of BGA/PCB Underfilled Assemblies Saeed Akbari and Jan K. Spelt  Abstract
Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Thermal Cycling Testing Stephan Meschter, Polina Snugovsky, Jeff Kennedy, Zohreh Bagheri, and Eva Kosiba  Abstract
SERDP Tin Whisker Testing and Modeling: Simplified Whisker Risk Model Development Stephen A. McKeown, Dr. Stephan J. Meschter, Polina Snugovsky, and Jeffery Kennedy  Abstract
Increasing the Reliability of Electronic Devices Stephen Coulson, Ph.D.  Abstract
Vibration Testing of Lead-Free Alloys for High Reliability Suthakaran Subramaniam, Polina Snugovsky, Jeffrey Kennedy, Eva Kosiba, Zohreh Bagheri, and Marianne Romansky  Abstract
Investigating Testing Conditions for Electromigration Evaluation and Effect of Additive Elements on Electromigration Resistance of Sn58bi Solder Xu Zhao, Ph.D., Masumi Saka, Ph.D., Mikio Muraoka, Ph.D., Mitsuo Yamashita, Ph.D. and Hiroaki Hokazono  Abstract
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