SOLUTIONS TO MEET HAND-HELD MARKET’S REQUIREMENT FOR LOW COST ADVANCED REFLOW AND ENVIRONMENTALLY SENSITIVE PACKAGINGAuthors: Fonzell Martin and Trent Thompson
Company: Motorola Semiconductor
Date Published: 5/15/2002 Conference: Telecom Hardware Solutions
Advance mold compounds with finer fillers are used to insure adequate mold flow and reduce surface tension on silicon. In addition, substrate suppliers are beginning to use chemically etch processing (MEC etch) to improve moisture performance by improving adhesion between substrate interfaces. There are requirements for finer line widths on BGA substrates with lower ball pitch (i.e. down to 0.65/ 0.5 mm). This creates challenges for packages to withstand higher temperature cycle gradient and higher reflow temperatures without introducing reliability failures such as trace cracking. With new emphasis being placed on cost reduction efforts, this report also looks at polyimide stress buffer elimination & land grid array package solutions and how these alternatives compare to standard reliability test - component and board level. Also discussed is solder joint reliability data on various Pb-free alternatives.
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