ASSESSING THE EFFECT OF FINE PITCH BGA PACKAGES ON MOTHERBOARD DESIGN AND BOARD LEVEL RELIABILITYAuthor: Michael Leoni & David Patten
Company: Motorola Semiconductor
Date Published: 5/15/2002 Conference: Telecom Hardware Solutions
However, reducing the pitch on SMT components requires trade-offs in design, assembly and reliability. This paper discusses the advantages and trade-offs of reducing ball pitch for package size reduction. Routing complexity on the component and board level, reduced feature sizes, assembly processes, component test hardware, solder joint life and cost are usually affected when BGA pitch decreases. Each of these trade-offs will be discussed including a method for finding package solutions that best meet customer needs.
Keywords: Substrate, pitch, reliability, design, solder-joint.
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