HERMETIC VS. NON-HERMETIC OPTOELECTRONIC PACKAGING: MEETING, NOT EXCEEDING APPLICATION REQUIREMENTSAuthors: Leo M. Higgins III, Ph.D.
Company: SiemensDematic EAS
Date Published: 5/15/2002 Conference: Telecom Hardware Solutions
Alternative materials and non-hermetic packaging constructs in use today will be reviewed and critiqued. New non-hermetic packaging approaches, incorporating metalized polymer housing structures, chip-on-board assembly, and refractive index matched polymer encapsulation will be presented and discussed in relation to market segments, application environment demands, and product life cycle. The case for development of engineering solutions to enable wider use of materials, laser, and fiber technologies that are widely acknowledged to offer the best price-to-performance opportunity in future high growth markets will be presented.
Key words: Optoelectronic Packaging, hermetic, nonhermetic.
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