Telecom Hardware Solutions Conference Proceedings


HERMETIC VS. NON-HERMETIC OPTOELECTRONIC PACKAGING: MEETING, NOT EXCEEDING APPLICATION REQUIREMENTS

Authors: Leo M. Higgins III, Ph.D.
Company: SiemensDematic EAS
Date Published: 5/15/2002   Conference: Telecom Hardware Solutions


Abstract: Optoelectronic Packaging generally implies the expensive hermetic packaging, which has become embedded in the telecommunication long haul backbone. Users of optoelectronic components for backbone applications have required extreme stability, reliability and long life. These demands have driven the use of expensive metal packages, metalceramic hybrid packages, glass-to-metal seals, noble metalbased component attach, multilayer ceramic interconnect, seam sealing, extensive gold plating, and has fostered the abhorrence of organic polymers. Hermetic packaging has provided a comfortable solution for engineers to exploit while active and passive functional units have raced through evolutionary and revolutionary changes. In this paper the rationale for hermetic packaging and the material systems utilized will be discussed.

Alternative materials and non-hermetic packaging constructs in use today will be reviewed and critiqued. New non-hermetic packaging approaches, incorporating metalized polymer housing structures, chip-on-board assembly, and refractive index matched polymer encapsulation will be presented and discussed in relation to market segments, application environment demands, and product life cycle. The case for development of engineering solutions to enable wider use of materials, laser, and fiber technologies that are widely acknowledged to offer the best price-to-performance opportunity in future high growth markets will be presented.

Key words: Optoelectronic Packaging, hermetic, nonhermetic.



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