Telecom Hardware Solutions Conference Proceedings


A NOVEL APPROACH TO THERMAL MANAGEMENT AND EMI SHIELDING VIA A METALLIC CONFORMAL COATING ON A PLASTIC HOUSING

Author: John Hannafin
Company: Parker Hannifin Corp.
Date Published: 5/15/2002   Conference: Telecom Hardware Solutions


Abstract: With the evolution of 3G wireless communications, the once benign thermal management requirements of portable handset design are quickly gaining potential for becoming long-term performance and safety roadblocks.

The need for EMI shielding of plastic-housed handsets, particularly wireless devices, has long been known and met through a variety of methods. The most common approach to shielding at the plastic enclosure level is to apply a conductive coating on the housing’s interior surface. Methods for applying this conductive layer include; sprayed conductive paint, vacuum deposited metallization and electroless plating. However, none of these existing techniques address the designer’s thermal management challenges.

A new method developed for applying a metallic conformal coating to plastic enclosures combines traditional EMI shielding performance with a heat-spreading material layer that provides an effective thermal management solution. Thermal performance data has been gathered for a typical power semiconductor component mounted to a plastic housing in a closed environment. The metallic conformal coating layer has been shown to lower both the junction temperature and the plastic enclosure temperature by as much as 30 °C.

Key words: thermal management, EMI shielding, conductive coating, adhesion, heat spreaders.



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