Telecom Hardware Solutions Conference Proceedings


HISTORY, TRENDS AND ISSUES RELATED TO MICROPROCESSOR PACKAGES USED IN HANDHELD WIRELESS PRODUCTS

Authors: Tom Gregorich and Edward Reyes
Company: Qualcomm Inc.
Date Published: 5/15/2002   Conference: Telecom Hardware Solutions


Abstract: Over the past few years the area array IC package has replaced the TQFP for the microprocessor in many handheld wireless products. The first-generation area array IC packages (PBGA) typically have smaller body size than their TQFP counterparts and feature a solder ball array instead of peripheral leads. Second-generation wireless area array packages (FBGA), which are the highest volume packages in production today, feature smaller terminal pitch, higher pin-count and may use multiple die. Third-generation packages (CSP) are still in the development stage and will feature even smaller terminal pitch and lower mounting height. Requirements for fourth-generation wireless IC packages have not been fully defined yet but will likely be driven by die technology and performance requirements of 3G wireless systems. This paper explores the history, technical issues and future trends of microprocessor packaging used in handheld wireless products.

Key words: Wireless, microprocessor, area array, TQFP, PBGA, FBGA, CSP, flip chip, stacked, wirebond, cellular.



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