LOW COST OPTOELECTRONIC COMPONENT FABRICATION AND PACKAGINGAuthors: Donald J. Hayes, Ting Chen and W. Royall Cox
Company: MicroFab Technologies, Inc.
Date Published: 5/15/2002 Conference: Telecom Hardware Solutions
The advantages provided by this approach fall into two categories. As a digital, additive technology, ink-jet printing is a highly flexible, automated process that translates into significantly lower manufacturing costs than traditional fabrication methods. It also provides unique capabilities for both increased levels of integration and new configurations in component fabrication and packaging. This paper will concentrate on Optics-Jet technology for the printing of microlenses for optical interconnects and on Solder-Jet technology for low-cost bumping of pads for flip chip, BGAs, and mBGAs, as well as for printing 3D conducting structures such as vertical vias. By utilizing a printing station with two print heads for dispensing both optical polymers and solder, a greater level of integration and package size reduction may be achieved in the manufacture of optoelectronic devices for telecom and other applications.
Keywords: micro-optics, ink-jet printing, solder bumping.
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