Telecom Hardware Solutions Conference Proceedings


LOW COST OPTOELECTRONIC COMPONENT FABRICATION AND PACKAGING

Authors: Donald J. Hayes, Ting Chen and W. Royall Cox
Company: MicroFab Technologies, Inc.
Date Published: 5/15/2002   Conference: Telecom Hardware Solutions


Abstract: In the drive to reduce the costs of manufacture for optoelectronic components the primary focus has been to increase the level of automation, especially for the packaging steps. To this end ink-jet printing technology may be utilized in direct writing of micro-optics and solder elements for a wide range of optical/optoelectronic fabrication applications, as well as for the precision dispensing of picoliter volumes of adhesives for component interconnect and packaging. Current examples of utilization of this technology include MOEMS switches, polymer-LED displays, and optical interconnections between light sources and optical fibers.

The advantages provided by this approach fall into two categories. As a digital, additive technology, ink-jet printing is a highly flexible, automated process that translates into significantly lower manufacturing costs than traditional fabrication methods. It also provides unique capabilities for both increased levels of integration and new configurations in component fabrication and packaging. This paper will concentrate on Optics-Jet technology for the printing of microlenses for optical interconnects and on Solder-Jet technology for low-cost bumping of pads for flip chip, BGAs, and mBGAs, as well as for printing 3D conducting structures such as vertical vias. By utilizing a printing station with two print heads for dispensing both optical polymers and solder, a greater level of integration and package size reduction may be achieved in the manufacture of optoelectronic devices for telecom and other applications.

Keywords: micro-optics, ink-jet printing, solder bumping.



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