CONDUCTIVE EPOXY ADHESIVES AS VIABLE ALTERNATIVES TO SOLDER: Sn/Pb COMPONENT COMPATIBILITYAuthors: C. Cheng, S. Smith, W. O’Hara, and V. Buffa
Company: Emerson & Cuming
Date Published: 6/11/2002 Conference: Advanced Technology Symposium
Three environmental conditions are employed to characterize the performance. They include damp heat (85°C/85%RH), 125°C and thermal cycling. Seven commercially available 0805 Sn/Pb resistors from different component suppliers are used to study the potential effect of components on the performance of conductive pastes. It is observed that there is more component compatibility concern with SMCAs than with solder paste. But overall, the electrical and adhesion performances of some SMCAs are very promising. SMCAs are viable alternatives to solder in applications utilizing cost effective Sn or Sn/Pb components in the Surface Mount Industry.
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