EFFECTS OF REFLOW PROFILE ON SHEAR STRENGTH OF Sn/4.0Ag/0.5Cu SOLDER SPHERES FOR BALL GRID ARRAY APPLICATIONSAuthors: Daryl Santos, et al.
Company: SUNY at Binghamton
Date Published: 6/11/2002 Conference: Advanced Technology Symposium
Ball Grid Arrays (BGAs) and Chip Scale Packages (CSPs) are increasingly used as an alternative to fine pitch leaded packages due to lower cost and higher manufacturing yields. In the past, failure mechanisms for the tin-lead alloy system on BGAs have been extensively studied. Unacceptable solder ball attachment has been reported in many studies and it has been linked to many factors including the substrate pad surface finish and attachment process. The purpose of this work is to discuss the role that reflow profiles have on this attachment process for lead-free solder spheres.
Keywords: Shear strength, surface finish, reflow process, failure modes, Pb-free, area array.
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