CASE STUDY: THE EFFECT OF SEVERE BLACK PAD DEFECT ON SOLDER BONDS ON BALL GRID ARRAY COMPONENTSAuthors: R. Champaign, J. Roepsch, and M. Downey
Company: Raytheon Electronic Systems
Date Published: 6/11/2002 Conference: Advanced Technology Symposium
This phosphorus-rich layer can deter the formation of nickel/tin (Ni/Sn) intermetallics that form the solder bond. Also, in severe cases, identifiable spikes or corrosion cracks can extend deep into the nickel layer. Unique to this analysis is the severity of the black pad as revealed by cracks that extend through the nickel. In severe black pad, corrosion spikes that extend completely through the nickel layer, provide a path for the solder to make contact to the copper layer below the electroless nickel. This allows the formation of Cu/Sn intermetallics at the solder ball to BGA pad interface.
In the BGA assemblies studied, the severity of the black pad is extensive, interfering with the formation of Ni/Sn intermetallics observed in a normal solder bond between Sn63Pb37 solder and a nickel pad. The Cu/Sn intermetallics anchored the BGA to the pad. After mechanical shock, separation occurred between the solder ball and BGA component interface. In a finished product, black pad is usually only detected when mechanical separation results in a functional failure and is followed by destructive analysis. Prior to mechanical failure, it can not be identified during visual inspection.
Keywords: BGA, Black Pad, Immersion Gold, Electroless Nickel, Mechanical Shock.
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