Advanced Technology Symposium Conference Proceedings


BMI RESINS AS LOW-STRESS ALTERNATIVES TO EPOXIES FOR OPTOELECTRONIC PACKAGE ASSEMBLY

Authors: Chris Perabo, B. Eng.
Company: Henkel Loctite Electronics
Date Published: 6/11/2002   Conference: Advanced Technology Symposium


Abstract: Recent optoelectronic analyses indicate that packaging costs account for 80% of component costs. Similar studies also show that costs for these components are too high for companies to purchase while maintaining solid business models and profitability.

Though it is becoming more obvious to manufacturers that adhesives exist to provide low-cost solutions to these issues, most package-level manufacturers only consider epoxy chemistries to be reliable enough to be used for their applications. High purity, low-stress silicones, UV acrylics and bismaleimide (BMI) resins however, can offer significant advantages over rigid epoxies and have been used in production applications for over a decade.

Though not widely understood, they are suitable for a range of potting, encapsulating and bonding applications such as pigtailing fiber-array packs to planar waveguides or bonding waveguides to heat generating devices to provide stable thermal performance. These low-cost solutions are achieved while providing rapid, in-line processing. This paper will focus on the role of BMI resins as low-stress alternatives to rigid epoxies for photonic and optoelectronic package assembly.

Key words: adhesives, optoelectronics, BMI resins, shrinkage, outgassing, hermeticity.



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