BMI RESINS AS LOW-STRESS ALTERNATIVES TO EPOXIES FOR OPTOELECTRONIC PACKAGE ASSEMBLYAuthors: Chris Perabo, B. Eng.
Company: Henkel Loctite Electronics
Date Published: 6/11/2002 Conference: Advanced Technology Symposium
Though it is becoming more obvious to manufacturers that adhesives exist to provide low-cost solutions to these issues, most package-level manufacturers only consider epoxy chemistries to be reliable enough to be used for their applications. High purity, low-stress silicones, UV acrylics and bismaleimide (BMI) resins however, can offer significant advantages over rigid epoxies and have been used in production applications for over a decade.
Though not widely understood, they are suitable for a range of potting, encapsulating and bonding applications such as pigtailing fiber-array packs to planar waveguides or bonding waveguides to heat generating devices to provide stable thermal performance. These low-cost solutions are achieved while providing rapid, in-line processing. This paper will focus on the role of BMI resins as low-stress alternatives to rigid epoxies for photonic and optoelectronic package assembly.
Key words: adhesives, optoelectronics, BMI resins, shrinkage, outgassing, hermeticity.
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