Advanced Technology Symposium Conference Proceedings


SOLDER SELECTION FOR PHOTONIC PACKAGING

Author: Brian O’Neill
Company: AIM Specialty Materials
Date Published: 6/11/2002   Conference: Advanced Technology Symposium


Abstract: As the worlds of electronics & photonics continue to merge, electronics manufacturers involved in traditional SMT assembly will be called upon to integrate optoelectronic component assembly into their SMT operations. While there are many challenges posed by the assembly of such complex hybrid packages, some of the most challenging revolve around how to assemble a diverse array of ceramic, glass and metal components within a package. Selecting the most appropriate solder for a particular application can help to manage some of these materials issues.

Keywords: Photonics, Assembly, Solders, Indium, Gold/Tin, Solder Joint Design, Au Films, CTE Mismatches, Fiber to Ferrule Soldering, Fluxless Soldering.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819