Advanced Technology Symposium Conference Proceedings


Author: Dominique Numakura
Company: DKN Research
Date Published: 6/11/2002   Conference: Advanced Technology Symposium

Abstract: A new solder mask technology of the multi-layer circuit boards has been developed for the high density surface mounting processes. According to the extreme miniaturization of the portable electronic products, higher density printed circuits have been required. The traditional solder mask processes have been the bottle neck for the high density circuit board capability because of dimensional changes of the boards during the manufacturing processes. A direct laser imaging process with the new photo-imageable solder mask materials could be the right solution to solve the technical barriers. The new process makes an exact dimensional correction for the solder mask patterns on the etched copper pads of multi-layer circuit boards.

The technology is able to minimize the clearance between the solder mask opening and the copper pads smaller than 25 micron. The new photo-imageable solder mask material developed for the process has equivalent or higher electrical and thermal properties than current materials, the new circuit boards have the same capabilities as traditional boards other than solder mask. The new solder mask technology enables the circuit designers to have more lines between soldering pads, and it gives more design flexibility without significant changes of design rules for high density SMT circuit boards.

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