ZERO CLEARANCE SOLDER MASK FOR HIGH DENSITY SMTAuthor: Dominique Numakura
Company: DKN Research
Date Published: 6/11/2002 Conference: Advanced Technology Symposium
The technology is able to minimize the clearance between the solder mask opening and the copper pads smaller than 25 micron. The new photo-imageable solder mask material developed for the process has equivalent or higher electrical and thermal properties than current materials, the new circuit boards have the same capabilities as traditional boards other than solder mask. The new solder mask technology enables the circuit designers to have more lines between soldering pads, and it gives more design flexibility without significant changes of design rules for high density SMT circuit boards.
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