Advanced Technology Symposium Conference Proceedings


Author: Raymond J. Iannuzzelli
Company: Hewlett-Packard Company
Date Published: 6/11/2002   Conference: Advanced Technology Symposium

Abstract: Non-soldered interposer sockets have been under development since the late ‘80s and are now attracting much attention from computer designers of high-end systems. There are two general types of interposer sockets, i.e. elastomer and metallic. As part of a product design effort in Compaq’s east coast alphaÒ development groups, there is an ongoing effort to characterize and understand the static & dynamic behavior of both types of interposer sockets since 1998. This effort comprises developing validated models, as well as, detailed component and application qualification testing, to assure the long-term reliability of the interposer socket. This paper details much of that work with potential application in future products.

Keywords: interposer, LGA socket, elastomer, non-soldered interconnect, finite element analysis.

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