DEVELOPMENT OF A COMPLIANT SOLDERAuthors: John Ranieri and Hsingching Crystal Hsu
Company: Georgia Institute of Tech.
Date Published: 6/11/2002 Conference: Advanced Technology Symposium
This study develops a new technology to design a compliant solder that can tailor to a solder joint’s desired end-use properties. The compliant interconnect is a solder system formed from any eutectic metal composition (e.g. lead-tin, silver-tin, indiumtin, etc.), and forms an interconnecting network of solder mini-elements with dense pore structures upon solidification. The regular distribution of free surfaces makes the solder system compliant and capable of relieving stresses in thin surface mounts. By adjusting parameters of the compliant solder, i.e., particle size, thickness of metal film on the particle, and type of metals, this technology can be used to custom design for specific applications, materials, and field conditions. This process can be used to engineer both the desired mechanical, morphological and compositional aspects within an interconnection thus tailoring to a solder joint’s desired end-use properties. In addition to customization capabilities of the design, the compliant solder can be manufactured in a just-in-time manner. The degree of compliance can be engineered into each formulation, based on the design requirements for both performance and reliability.
Key words: Compliant solder, porous, eutectic.
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