ORGANIC POLYMER-BASED NONHERMETIC OPTOELECTRONIC PACKAGING OPPORTUNITIES AND ISSUESAuthors: Leo M. Higgins III, Ph.D.
Company: Siemens Dematic
Date Published: 6/11/2002 Conference: Advanced Technology Symposium
In this paper non-hermetic optoelectronic packaging is proposed as a medium for the reestablishment of rapid growth of data-telecom networks and optoelectronics due to the significant cost benefits. The current organic polymer material properties that are viewed as impediments to use in the highest reliability optoelectronic products will be critically discussed. Possible engineering solutions to allow polymers to be used in these high reliability products will be presented. The growing acceptance of non-hermetically packaged optoelectronic components in large elements of the network rim will be demonstrated with examples, and the rationale for successful polymer use in these applications will be assessed and contrasted with expectations for hermetic components. Lower cost packaging of lower cost laser components in systems interconnected by lower cost optical fibers is discussed as a means to meet the needs of what should be the largest growth segment in the optoelectronics market.
Key words: Optoelectronic Packaging, hermetic, nonhermetic, polymer packaging.
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