SOLDERABILITY OF DIFFERENT BOARD FINISHES UNDER NITROGEN ATMOSPHERES WITH DIFFERENT ROLSAuthor: Klaus Wilke
Company: Messer Griesheim
Date Published: 9/12/1999 Conference: SMTA International
Additionally to Part 1, which was focused on the dependence of the solderability of OSP (Organic solderable preservatives) on the ROL, this part describes the solderability of HAL and NiAu surfaces.
To characterize and to optimize wetting properties different solders were compared by investigating the surface tension dependence on different atmospheres and temperatures.
These results are important for the manufacturers to integrate different finishes and solder materials in their soldering processes.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.