Optoelectronics and Telecom Conference Proceedings


CRITICAL ISSUES IN OPTOELECTRONIC ASSEMBLY

Authors: Ronald C. Lasky, Ph.D., PE
Company: Speedline Technologies
Date Published: 11/14/2001   Conference: Optoelectronics and Telecom


Abstract: Optoelectronics presents new challenges and opportunities for electronic assemblers. From sub-micron tolerances for laser diode alignment to fiber handing to electrical performance testing, optoelectronics challenges assemblers in technologies that are often very foreign. This paper will be an overview of optoelectronics in general and assembly of optoelectronics in particular.

Specifically the paper will cover: 1. An overview of optoelectronics technology. Why is it the technology of choice for communications? How it works? Examples of the technology. 2. The techniques and issues in component assembly including sub-micron alignment and tolerance control. 3. Module assembly. 4. How Opto Printed Wiring Board (PWB) assembly differs from standard PWB assembly, including fiber handling, cleaning and protecting the optical components from thermal shock. 5. Systems assembly and test, including Bit Error Rate (BER) and performance testing.



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