PROCESS OBSERVATION AND CONTINUOUS IMPROVEMENT IN A LASER MANUFACTURING ENVIRONMENTAuthors: Hendra Hartono, C. R. Emerson, Ph.D.
Company: SUNY at Binghamton
Date Published: 11/14/2001 Conference: Optoelectronics and Telecom
One of the findings from the study included the bubbling activity, which occurred at the packaging stage. It was observed that the usage of water-based flux caused the bubbling activity. In addition, the flux activation caused outgassing. Consequently, the bubbling activity resulted in void formation within the solder joint. A scrubbing method was utilized to reduce the void formation. However, voids still existed within the solder joint. Cross-sections of the laser array packages confirmed that the voids had formed in the solder joints.
In order to improve the process, a different approach to laser array packaging was undertaken. A capillary flow attachment process was developed to eliminate the void formation. The capillary flow method uses the capillary actions of melting solder to flow between the pre-heated laser array and heated substrate. Cross-section of the laser array packages, using the capillary flow attachment process, exhibited no void formation. Elimination of the voids is one step toward improving the robustness of the laser array packaging.
Key words: Die attachment, laser array attachment, laser array packaging.
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