SMTA International Conference Proceedings


RELIABILITY OF PBGA ASSEMBLIES UNDER VIBRATION

Author: Z.P. Wang
Company: Gintic Institute of Mnfctr.
Date Published: 9/12/1999   Conference: SMTA International


Abstract: To understand the high-cycle reliability of Plastic Ball Grid Array (PBGA) interconnections against external vibration loading, vibration testing of a PBGA assembly was conducted. The test vehicle is an assembly with four 256 I/Os PBGA modules mounted on a FR-4 Printed Circuit Board (PCB). In the test, the assembly was clamped at two opposite sides on a fixture which was bolted to a vibration shaker. The shaker provided a constant-amplitude foundation vibration source for the PBGA assembly. During the test, the resistances of PBGA modules were continuously monitored, so that any fatigue failure could be detected, and the vibration-cycle-to-failure of the PBGA modules measured. In this paper, the test setup and procedures are described, test results and analysis regarding the vibration-cycle-to-failure of the PBGA interconnections are presented, and the typical vibration fatigue failures in the PBGA interconnections are identified.



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