SMTA International Conference Proceedings


ROOM TEMPERATURE ADHESION IN SILICONE ENCAPSULANTS

Author: Kelly J. Wall
Company: Dow Corning Corporation
Date Published: 9/12/1999   Conference: SMTA International


Seika Machinery, Inc.

Abstract: Encapsulants based on silicone technology have a well-established history in electronics applications, used as protective materials to improve the reliability and service life of miniaturized components and leads. Along with physical protection and corrosion resistance, silicone encapsulants provide a number of wide-ranging benefits to surface mount designs, including good dielectric properties and easy processing.

These formulations are generally very stable materials, capable of withstanding wide temperature swings and offering a service range of about -40oC to 200oC. For extreme environments, specific formulations are effective as low as -80oC or as high as 300oC for short term exposure. These encapsulating materials resist ozone, moisture and ultraviolet degradation, and provide a barrier against contamination.

Silicone encapsulants are typically elastomeric materials, and by nature have good dielectric properties that remain fairly constant over a wide temperature range. In applications involving thermal cycling, their inherent flexibility provides a critical stress relief mechanism that helps absorb the energy created by substrates with different coefficients of thermal expansion (CTE). The same properties bring additional benefits in vibration dampening and enhanced shock resistance.



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