ROOM TEMPERATURE ADHESION IN SILICONE ENCAPSULANTSAuthor: Kelly J. Wall
Company: Dow Corning Corporation
Date Published: 9/12/1999 Conference: SMTA International
These formulations are generally very stable materials, capable of withstanding wide temperature swings and offering a service range of about -40oC to 200oC. For extreme environments, specific formulations are effective as low as -80oC or as high as 300oC for short term exposure. These encapsulating materials resist ozone, moisture and ultraviolet degradation, and provide a barrier against contamination.
Silicone encapsulants are typically elastomeric materials, and by nature have good dielectric properties that remain fairly constant over a wide temperature range. In applications involving thermal cycling, their inherent flexibility provides a critical stress relief mechanism that helps absorb the energy created by substrates with different coefficients of thermal expansion (CTE). The same properties bring additional benefits in vibration dampening and enhanced shock resistance.
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