SMTA International Conference Proceedings


HIGH PERFORMANCE BALL GRID ARRAY ASSEMBLIES FOR HIGH TEMPERATURE AND HIGH ALTITUDE APPLICATIONS

Authors: Puligandla Viswanadham
Company: Raytheon Systems Co.
Date Published: 9/12/1999   Conference: SMTA International


Abstract: Area array packages such as ball grid array packages are becoming increasingly popular in many commercial and industrial electronic applications. Their insertion into military products is impeded for want of more mechanical and thermal cycling reliability data pertinent to their operating environment. In this paper is described an application of high density, high performance ball grid array packages for high altitude high temperature avionics application. Thermal and mechanical modeling preceded the fabrication and assembly of the printed wiring boards in order to assess the applicability. The circuit card structure, assembly and first article testing are described. It was demonstrated that the selected PWB and area array package combination could meet the reliability objectives of the airborne application under consideration.

Keyword: BGA, Reliability, Thermal Cycling, Vibration, First Article Test, Altitude, Airborne.



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