SMTA International Conference Proceedings


REVIEW OF WAFER LEVEL CSP DEVELOPMENTS

Author: E. Jan Vardaman
Company: TechSearch International
Date Published: 9/12/1999   Conference: SMTA International


Abstract: With the demand for smaller, lighter, thinner portable products has come the need for a new semiconductor package—hence the birth of CSPs. The growth in chip size/chip scale package is an enabler in the production of today’s hot portable products. CSPs have seen widespread adoption, especially in Japan. Devices packaged with this substrate include flash memory, SRAMs, ASICs, microcontrollers, and digital signal processors (DSPs). New DRAM memory devices based on the Rambus architecture hold promise for high volume applications. Applications containing CSPs include digital camcorders and cameras, cellular phones, memory cards, computers, and modem cards. Many of these products are in second and third generations.



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