SMTA International Conference Proceedings


BROADENING THE CERAMIC CSP MARKET FOR HIGHER RELIABILITY APPLICATIONS

Author: Shoji Uegaki
Company: Kyocera Corporation
Date Published: 9/12/1999   Conference: SMTA International


Seika Machinery, Inc.

Abstract: Driven by the rapid advancement of portable electronic equipment adoption of Chip Scale Packaging (CSP) has drastically increased. There are a great many CSP offerings, utilizing various materials and technology, introduced into market. Ceramic CSP utilizing ceramic material as a rigid carrier is one of them. Ceramic technology has many advantages such as fine design rule, adaptability of various interconnect technology and the cost of carrier from maturity of the technology. Ceramic is a suitable material for the carrier of CSP.

Kyocera has developed Snap Array CSP™ that is wire bond type CSP. Utilizing the advantages of ceramic technologies an optimized cost and performance offering has been created for the consumer application market. According to the rapid and wide adoption of CSP, applications for CSP has started to broaden from not only consumer portable equipment, but to industrial applications such as telephone switching system and Hi-reliability applications such as satellite systems. In order to meet those requirements for broadened applications, continuous development has been conducted with targeting improvement of moisture resistance of Snap Array CSP. In addition, realization of CSP with hermetic sealing to comply with MIL-STD-883E requirements and with higher I/O and larger body size utilizing new ceramic material HITCE™ has been accomplished. HITCE™ is a new Low Temperature Cofired Ceramic (LTCC) which higher TCE value than standard Alumina ceramic.

From environmental consciousness standpoint, adoption of Pb-free solder is already in a "count down" situation with many arguments. Currently the majority of Pb-free solder which has begun adoption is Sn/Ag based solder. We have evaluated the adaptability of those Pb-free solder materials to Snap Array CSP.

This report will describe the detail of development and the result of evaluation.



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