1999 STATUS OF BGA / CSP STANDARDIZATIONAuthor: Mark Bird
Company: Amkor Technology
Date Published: 9/12/1999 Conference: SMTA International
The standardization must also occur not only regionally like JEDEC (USA) and EIAJ (JAPAN) but it must be taken to the next level. The next level in packaging is IEC (International) TC-47D. It is of the primary importance to reduce the possible variations while not limiting the customer’s ability to select the most reliable cost-effective package for his or her market application. The introduction of Ball Grid Array packages has created a packaging concept for the board assembler that has allow them to go back to older equipment for pick and place as well as not having to worry about peripheral leaded package coplanarity and bend or skewed leads. The BGA has also reduced the concern of the assembler placing fine pitch (0.50, 0.40, 0.30 and lower mm) peripheral leaded packages. The disadvantage of the BGA / CSP package is that it is an array style package and can have many variations of ball pitches, ball sizes and ball counts for each body size. A CSP (Chip Size Package) is basically a thinner, smaller, and a finer pitch version of a BGA. This flexibility makes the need for Standardization more critical than is was for peripheral leaded packages.
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