TRENDS IN ELECTRONIC PRODUCTS AND PLACEMENT EQUIPMENTAuthor: Kevin Towle
Date Published: 9/12/1999 Conference: SMTA International
In the future, the circuit board and the components will converge. The discrete components will be integrated into the inner layer of the circuit board and silicon microcircuits or dies will be bonded directly to the substrate of the board. Electronic products that are the size of a lunch box will be reduced to a size that will fit into your pocket.
In order for electronic manufacturers to take advantage of these new trends in component packaging technologies, the equipment manufacturers must develop equipment to support the evolution of the component packaging technology. The future equipment must be based on a platform strategy that will enable the manufacturer to quickly develop applications to support the demands of the rapidly evolving component technology. Th future equipment will extend beyond the placement process, and will focus on the total assembly (placement and attachment) process. The equipment manufacturers will also be asked to increase placement rates, improve machine utilization (reduction in setup time and replenishment time), and improve equipment reliability and process quality. The equipment will become more reliant on software and on an integrated information network.
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