LEAD-FREE SN3.5AG AND SN0.7CU WAVE SOLDER EVALUATION WITH VOC-FREE NO-CLEAN AND WATER SOLUBLE FLUXESAuthor: Jasbir Bath
Company: Solectron Corporation
Date Published: 6/12/2001 Conference: Advanced Packaging Technology
Cross-sections of various through-hole components soldered using the lead-free solders showed reduced holefill compared to those soldered with tin-lead solder. This was particularly the case whenno-clean flux was used. In some instances soldering defects such as fillet lifting on tin-lead HASL coated boards were observed. Mechanical pull test data was also reviewed for SOIC and chip joints wave soldered using lead-free and tin-lead solders. Temperatures were determined on certain components on the board during the wave soldering operation with the lead-free solders. The temperatures used with the lead-free solders were slightly higher than those used presently for tin-lead.
Keywords: lead-free, Sn3.5Ag, Sn0.7Cu, Sn37Pb, VOC-free flux, no-clean flux, water-soluble flux, wave soldering, solderability, visual defects, holefill, X-ray laminography, microstructure, fillet lifting, pull tests, shear tests, thermal cycling, temperature profiling, flux deposition, drossing, HASL, NiAu, OSP, impurity levels.
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