JOINT FAILURES, LEAD CONTAMINATION AND OTHER IMPORTANT CONSIDERATIONS FOR LEAD-FREE ELECTRONICS ASSEMBLY
Authors: Karl Seelig and David Suraski Company: AIM Date Published: 6/12/2001
Advanced Packaging Technology
Abstract: With the WEEE Directive in Europe (in its most recent revision) potentially outlawing lead from electronics produced and imported in the EU by 2006 and foreign competition driving the implementation of lead-free electronics assembly around the world, additional questions regarding the integrity and reliability of various alloy compositions continue to arise. In short, the issue of which alloy(s) to select continues to loom. This paper shall take an in-depth view of Sn/Ag, Sn/Ag/Cu and Sn/Cu alloys and compare the reliability testing results and process considerations for these.