Advanced Packaging Technology Conference Proceedings


Author: David Suraski
Company: AIM
Date Published: 6/12/2001   Conference: Advanced Packaging Technology

Abstract: Due to the increasing popularity of no-clean soldering processes and the relatively large amount of flux residue left by no-clean solder pastes (especially during intrusive reflow), ensuring the reliability of pin probe testing has become a complex task. In theory, all solder pastes are pin probe testable. However, many of the currently available no-clean solder pastes leave residues that are not easily pin tested under a broad range of applications. Furthermore, many solder pastes marketed as “pin probeable” leave residues with marginal insulation characteristics that can result in poor long-term reliability.

In addition to paste chemistry, the pin probe testability of a solder paste is directly dependent upon SMT process factors such as the length of time between reflow and testing and the type and number of reflow profiles to which the paste is exposed. Furthermore, several pin probe testing processes affect the reliability and repeatability of the pin probing process. Included in these factors are the type of probes utilized, the spring forces, and the type of parts being probed. This paper shall address the difficulties that may be encountered during the pin probe testing of no-clean solder paste residues and will discuss the means by which many of the difficulties currently associated with can be eliminated. These methods of simplifying the pin probe testing process will address solder paste requirements as well as pin probing materials and process considerations.

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