SOLDERABILITY OF DIFFERENT BOARD FINISHES UNDER NITROGEN ATMOSPHERES WITH DIFFERENT ROLS
Author: Jens Tauchmann Company: Messer Griesheim Date Published: 9/12/1999
Abstract: To support the manufacturers at the optimization of the reflow process examinations were carried out concerning the influence of the Residual Oxygen Level (ROL) on the solderability of current components and circuit board surfaces. Additionally to Part 1, which was focused on the dependence of the solderability of OSP (Organic solderable preservatives) on the ROL, this part describes the solderability of HAL and NiAu surfaces. To characterize and to optimize wetting properties different solders were compared by investigating the surface tension dependence on different atmospheres and temperatures. These results are important for the manufacturers to integrate different finishes and solder materials in their soldering processes.