Advanced Packaging Technology Conference Proceedings


Author: Anthony J. Rafanelli
Company: Raytheon Naval & Maritime
Date Published: 6/12/2001   Conference: Advanced Packaging Technology

Abstract: With ever increasing activities in developing alternative material technologies as substitutes for lead-bearing solders, questions have arisen, in the defense manufacturing community, as to how such changes will affect Department of Defense (DoD) and aerospace product lines. Areas of concern can be categorized into two major issues: 1. Development of in-house processes to accommodate new interconnection technologies 2. Qualifying and/or validating these materials for use in harsh environments. This paper will provide details on these areas of concern as well as discuss some perspectives and possible courses of action. Included will be a short summary of discussions at the 2000 ASME International symposium on “ALTERNATIVES TO LEAD SOLDER: VIEWS, CONCERNS, AND ISSUES FOR USE IN MILITARY ELECTRONICS AND OTHER HARSH ENVIRONMENTS” held in November 2000 in Orlando, FL. An objective of this paper would be to help develop a framework to address all concerns and provide a forum for future discussion and action.

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