Advanced Packaging Technology Conference Proceedings


Compatibility of Lead-free Solders and Surface finishes

Authors: Alan Rae, Gene Smelik, Jim McLenaghan
Company: Cookson Electronics
Date Published: 6/12/2001   Conference: Advanced Packaging Technology


Abstract: This detailed paper reviews the results of an extensive program to evaluate the processability and reliability of lead-free alloys with lead-free surface finishes in wave, reflow and fine pitch applications. This program is designed to be complementary to other lead-free evaluations such as the NEMI lead-free program and, taken together with these other programs will allow assembly and packaging manufacturers to make intelligent materials choices based on hard statistically valid data.

KEYWORDS: Lead-free, assembly, wave, solder, surface finish.



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