Advanced Packaging Technology Conference Proceedings


Author: Alan Rae
Company: Cookson / Alpha Metals
Date Published: 6/12/2001   Conference: Advanced Packaging Technology

Abstract: As more frequencies are opened up from government to consumer use, cost-effective materials solutions are needed. The materials sets that worked well at 1.8 GHz and perhaps 2.5 GHz are inadequate when we move towards 10GHz. This paper reviews the changes in materials systems that are required and describes results of high frequency measurements on substrate materials, packaging materials, plated surfaces and interconnect materials such as solders and fluxes and proposes a systems approach to testing materials sets.

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