Advanced Packaging Technology Conference Proceedings


Authors: Thomas Koschmieder, Michael Leoni, and Jesse Phou
Company: Motorola Semiconductor
Date Published: 6/12/2001   Conference: Advanced Packaging Technology

Seika Machinery, Inc.

Abstract: With the advent of Lead (Pb)-free requirements on the environment, consumer electronic manufacturers have become increasingly sensitive to the Pb content within electronic components, and a shift to using Pb-free solder across select markets of the industry seems inevitable. However, because Pb-free solder requires a higher reflow temperature, there are concerns about the package performance and reliability. The elevated temperatures may cause new package stresses and other thermal-related challenges. One issue is the “popcorning” effect that may result when moisture build-up within an IC package expands and causes cracks, voids, or interfacial delamination. A second major issue concerns the Pb-free solder joint reliability. For the MAP package, there are currently two Pb-free terminal interconnection options—Pb-free solder spheres and LGAs. In the following paper, moisture performance results at various temperature/humidity conditions and reflow temperatures are presented for a variety of MAP packages. In addition, solder joint reliability data is presented and a comparison is made between Pb-solder and the mentioned Pb-free alternatives. The methods used to assemble the test boards and solder joint failure analysis are also included.

Key Words: Lead (Pb)-free, BGA, LGA, solder joint, MAPBGA, reliability, delamination.

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