IMPLEMENTING BALL GRID ARRAYS IN AN ELECTRONICS MANUFACTURING SERVICE PROVIDER’S ENVIRONMENTAuthors: Arun Gowda, Robert Murcko, and K. Srihari, Ph.D.
Company: SUNY, Binghamton
Date Published: 6/12/2001 Conference: Advanced Packaging Technology
BGAs are compatible with the standard surface mount technology assembly. The key processes in the assembly of BGAs are stencil printing, component placement, and reflow soldering. Handling/storage, cleaning, inspection and test, and rework are also important processes that need to be addressed in BGA assembly. This paper presents the implementation procedure followed to successfully implement BGAs at a medium volume-medium mix EMS provider’s facility.
Extensive literature study yielded comprehensive knowledge of the various industry standards, assembly process issues and guidelines for optimum yield. Each step in the BGA assembly process was optimized for a representative BGA test board. In addition to the various assembly process optimization techniques employed, BGA handling, inspection, test, and storage issues were also dealt with. Work instructions and training sessions were conducted to educate the inspection and assembly floor personnel about the appropriate methods of handling and inspecting BGAs. The various assembly equipment were characterized to record the optimum operating characteristics in terms of the process capability Cpk. These values can be used to evaluate new equipment and to measure the performance of the assembly line after a certain period of time.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.