LEAD-FREE REWORK PROCESS FOR CHIP SCALE PACKAGESAuthors: Arun Gowda and K. Srihari, Ph.D.
Company: SUNY, Binghamton
Date Published: 6/12/2001 Conference: Advanced Packaging Technology
In this research endeavor, lead-free CSPs with tin-silver and tin-silver-copper solder balls were assembled and reworked. In addition, tin-lead CSPs were assembled and reworked as a baseline for comparison. Different rework sequences, redressing and fluxing techniques were evaluated. Post-assembly and post-rework analysis was done following assembly and rework using x-ray inspection, standoff measurements and cross-section microscopy. The reworked assemblies have completed 920 cycles of 0 degrees C to 100 degrees C Air-to-Air Thermal Cycling (AATC). No instances of time-zero electrical failures were found in post-rework tests Useful guidelines for lead-free rework of fine-pitch components and CSPs in particular were developed and are presented in this paper.
Key words: lead-free, CSP, BGA, rework.
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