Advanced Packaging Technology Conference Proceedings


EVALUATION OF ADVANCED MATERIALS TO SATISFY HIGHER REFLOW AND SOLDER JOINT LIFE REQUIREMENTS ON MAP BGA

Authors: Mark Gerber, Trent Thompson and Shawn O'Connor
Company: Motorola Semiconductor
Date Published: 6/12/2001   Conference: Advanced Packaging Technology


Seika Machinery, Inc.

Abstract: This paper discusses the use of advanced integrated circuit component materials on the thin MAP BGA to increase package interfacial adhesion at elevated reflow temperatures to satisfy customer requirements. These materials were evaluated to investigate moisture level performance and solder joint reliability for cellular phone based applications. The four material sets that were used showed both positive and negative moisture level and solder joint reliability results. The moisture level results seem to correlate with the amount of die attach epoxy voiding/coverage when further investigated through failure analysis. There are several factors that can affect the amount of die attach coverage and voiding in the die attach epoxy region of the package. These include process steps such as substrate pre-bake, die attach dispense, epoxy preparation, and die attach cure. Solder joint reliability results showed significant differences between the 4 material sets but could not be attributed to any one specific material within the package. The same material sets that failed at the elevated temperature moisture level evaluations exhibited a lower level of solder joint life.



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