“FLASHSOLDERING” – A NEW NON-CONTACT SELECTIVE SOLDERING PROCESS FOR SMT COMPONENTSAuthor: David W. Steinmeier
Company: microJoining Solutions
Date Published: 9/12/1999 Conference: SMTA International
Four elements comprise the FlashSoldering System. The first element is the substrate, which can be a flexible or rigid PCB.
The second element is the SMT component or connector with “gull wing” style leads or a flexible ribbon cable.
The third element is a precise amount of solder. The solder is plated onto both the substrate or component leads or is mechanically attached to the component or connector leads in the form of a solder bearing “nugget” which may contain flux. Solder can also be applied in the form of a precise amount of dispensed solder paste.
The fourth and final element is a diode laser heat source. Non-contact diode laser heat reflows the solder plating or solder bearing “nugget” on the SMT component to the substrate to complete the solder joint.
Applications for FlashSoldering include: single and multiple toroidal transformer packaging; LAN filters; low power DC-DC converters; woven or braided high speed data cables; and miniature temperature sensitive SMT components, connectors, and flexible ribbon cable attachment to rigid or flexible PCB’s.
Key Words: DC-DC Converter, Diode Laser, Electronic Contact, FlashSoldering, Flexible Ribbon Cable, High Speed Data Cables, Insulated Magnet Wire, LAN Filters, Miniature Toroidal Transformer, SMT Components, and SMT Connectors.
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