Advanced Packaging Technology Conference Proceedings


Author: Cemal Basaran
Company: University at Buffalo, SUNY
Date Published: 6/12/2001   Conference: Advanced Packaging Technology

Abstract: The study of solder joint reliability is a significant issue in electronic packaging. Solder joints are subjected to cyclic strain due to thermal expansion mismatch between the bonded layers, as a result they undergo elastic, plastic and creep deformations, and finally experience microcracking and damage. There is very little test data available in the literature about thermomechanical response of actual micron scale solder joints in BGA products. In this study, a ball grid array (BGA) package was thermally cycled between -55 degrees C and 125 degrees C by using a large capacity Super AGREE thermal chamber. High sensitivity Moiré Interferometry is used for measuring the irreversible strain field during cycling. A novel specimen preparation technique allowed us to measure irreversible strain accumulation up to failure. The technique used casts a new look in the application of Moiré Interferometry method to fatigue testing. Previously reported similar studies in the literature included one thermal cycle only. This new technique allows recording plastic deformations up to failure of the solder joint.

Key Words: BGA solder joints, fatigue life, Moiré Interferometry, damage mechanics.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819