THE PRACTICAL WIRE SWEEP ANALYSIS SOFTWARE- INPACK, AND VERIFICATION FOR PBGA, STACKED CSPAuthor: Vincent Tu
Company: ChipMOS TECHNOLOGIES INC.,
Date Published: 2/13/2001 Conference: Pan Pacific Symposium
This paper reports a more practical wire sweep analysis solution developed by ChipMOS. This new methodology is not only accurate in solving and efficent in modeling, but also friendly in use and has a flexble interface in simplifying the actual application. This new in-house wire sweep analysis software is named “InPack”. It is capable of connecting the global flow analysis (C-MOLD) and structure analysis (ANSYS, ABAQUS) to provide the total solution for wire sweep assessment. The wire geometry is easy to be modeled and the software could generate the detail loop shape automatically. In addition, the multi-layer data requisition criteria is captured to simulate the actual flow conditions around a wire inside the mold cavity. The friendly user interface, “Input-Execute-and-See”, could reduce the procedure of wire sweep analysis dramatically. Two examples are executed to verify the accuracy of wire sweep prediction. The first is the PBGA 90L (quadri- dice MCM package). This package has long loop wire and with high pin count. The other one is the Stacked CSP with two dice and two layers loop height plus the special reverse bond shape. The predicted results from the InPack analysis show a good agreement with the actual measurement in both the trend and accuracy.
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