Pan Pacific Symposium Conference Proceedings


SUPERIOR STRUCTURE BUILD-UP SUBSTRATE, "ADVANCED DV-MULTI" FOR PACKAGING

Authors: Shinji Sumi, Hirofumi Nakamura, Hisaya Takahashi,
Company: NEC Toyama, Ltd.
Date Published: 2/13/2001   Conference: Pan Pacific Symposium


Abstract: Since 1996, we have provided a build-up PWB named "DV-MULTI (Dimple Via-MULTI layer boards)", which is the ultra high-density build-up substrate with excellent reliability for the high-density devices,e.g.barechip and CSP,etc. Although the semiconductor packaging customers require our build-up substrates with higher reliability performances and with more circuitry. Therefore we have evolved the “Advanced DV-MULTI” by improving the additive electroless Cu plating process, the new permanent photo resist and insulation layers material, the high accuracy UV-YAG laser ablation process.

Technologies for 20 µm line width and space and 40 µm diameter via have been obtained from new permanent photo resist, refined additive electroless Cu plating solution and using high accuracy UV-YAG laser system. The permanent photo resist has the resistance to high alkaline electroless Cu plating solution. We can control permanent photo resist height using spin coater system. UV-YAG laser has superior performance, such as via placement accuracy within +/- 3 µm, high throughputs of 500 holes/sec (50 µm diameter) and via diameter range of 40 µm to 80 µm. Insulation materials has special properties of electrical, thermal and mechanical. The dielectric constant (at 1MHz) is 3.7 and loss tangent (at 1MHz) is 0.020. The glass transition temperature is 170 centigrade. [1] [2] Key words Build-up substrate, High reliability, RCC (Resin Coated Copper), Fully Additive Process, UV-YAG laser



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