SUPERIOR STRUCTURE BUILD-UP SUBSTRATE, "ADVANCED DV-MULTI" FOR PACKAGINGAuthors: Shinji Sumi, Hirofumi Nakamura, Hisaya Takahashi,
Company: NEC Toyama, Ltd.
Date Published: 2/13/2001 Conference: Pan Pacific Symposium
Technologies for 20 µm line width and space and 40 µm diameter via have been obtained from new permanent photo resist, refined additive electroless Cu plating solution and using high accuracy UV-YAG laser system. The permanent photo resist has the resistance to high alkaline electroless Cu plating solution. We can control permanent photo resist height using spin coater system. UV-YAG laser has superior performance, such as via placement accuracy within +/- 3 µm, high throughputs of 500 holes/sec (50 µm diameter) and via diameter range of 40 µm to 80 µm. Insulation materials has special properties of electrical, thermal and mechanical. The dielectric constant (at 1MHz) is 3.7 and loss tangent (at 1MHz) is 0.020. The glass transition temperature is 170 centigrade.   Key words Build-up substrate, High reliability, RCC (Resin Coated Copper), Fully Additive Process, UV-YAG laser
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