IC PACKAGE SOLUTIONS FOR HIGH PERFORMANCE MEMORYAuthor: Vern Solberg
Date Published: 2/13/2001 Conference: Pan Pacific Symposium
To meet the need for packaging a silicon die for these faster processing speeds, Tessera has developed a two-sided copper, flexible polyimide film based interposer substrate employing laser ablated micro-vias. The chip-size package (unlike face-up wire bonded or direct chip attachment package structures), relies on the proven compliant BGA material system for both reliability and performance. The two metal layer interposer structure supplies a very direct die-to-ball contact interconnect and a robust ground plane within the finished package.
The following will outline the process steps and design attributes that enable the fabrication of one and two metal layer flex-based interposer and the die packaging process (step-by-step).
Key Words: BGA, BGA®, Chip Scale Packaging, CSP, Ball Grid Array, Fine Pitch Ball Grid Array, FBGA, RDRAM®, DDR SDRAM.
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